WG82574L S LBA8 Intel, WG82574L S LBA8 Datasheet - Page 449

• Manufacturer Part Number: WG82574L S LBA8
• Manufacturer: Intel

Specifications of WG82574L S LBA8

• Operating Supply Voltage (typ): 3.3V
• Operating Temp Range: 0C to 85C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 64
• Lead Free Status / RoHS Status: Compliant

Design Considerations—82574 GbE Controller
13.9.4
Figure 82.
Landing Pattern B (Thermal Relief; No Via In Pad)
This landing pattern (vias outside Exposed Pad*) provides thermal relief, adequate
solder coverage, and less solder voiding; however, it does not provide an extended
ground connection. This landing pattern also meets Intel’s recommendation for
coverage >= 80%.
82574 Landing Pattern B (Top View - Vias on the Outside of the Exposed
Pad*)
Intel recommends using 16 vias evenly placed (as shown in
extended ground connection. Additional vias can be added to improve conductivity. A
minimum of 12 larger vias (14 to 20 mil finished hole size) can also be used.
44 mil anti-pad
32 mil via pad
10 mil finished hole (small via)
14 to 20 mil finished hole (large thermal via)
40 mil mimimum
8-spoke pattern
thermal relief
Figure
82) around the
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