WG82574L S LBA8 Intel, WG82574L S LBA8 Datasheet - Page 452

• Manufacturer Part Number: WG82574L S LBA8
• Manufacturer: Intel

Specifications of WG82574L S LBA8

• Operating Supply Voltage (typ): 3.3V
• Operating Temp Range: 0C to 85C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 64
• Lead Free Status / RoHS Status: Compliant

14.0
14.1
14.2
14.3
Note:
14.4
452
Thermal Design Considerations
Introduction
This section describes the 82574 thermal characteristics and suggested thermal
solutions. Use this section to properly design a thermal solution for systems
implementing the 82574.
Properly designed solutions provide adequate cooling to maintain the 82574 case
temperature (Tcase) at or below those listed in
by providing a low, local ambient temperature and creating a minimal thermal
resistance to that local ambient temperature. Heat sinks might be required if case
temperatures exceed those listed in
temperature at or below those recommended in this section, the 82574 will function
properly and reliably.
Intended Audience
The intended audience for this section is system design engineers using the 82574.
System designers are required to address component and system-level thermal
challenges as the market continues to adopt products with higher-speeds and port
densities. New designs might be required to provide better cooling solutions for silicon
devices depending on the type of system and target operating environment.
Measuring the Thermal Conditions
This section provides a method for determining the operating temperature of the 82574
in a specific system based on case temperature. Case temperature is a function of the
local ambient and internal temperatures of the component. This section specifies a
maximum allowable Tcase for the 82574.
Removal of the shield lid is required to measure the case temperature.
Thermal Considerations
Component temperature in a system environment is a function of the component,
board, and system thermal characteristics. The board/system-level thermal constraints
consist of the following:
• Local ambient temperature near the component
• Airflow over the component and surrounding board
• Physical constraints at, above, and surrounding the component that might limit the
size of a thermal enhancement
Table
82574 GbE Controller—Thermal Design Considerations
93. By maintaining the 82574 case
Table
93. Ideally, this is accomplished