WG82574L S LBA8 Intel, WG82574L S LBA8 Datasheet - Page 448

• Manufacturer Part Number: WG82574L S LBA8
• Manufacturer: Intel

Specifications of WG82574L S LBA8

• Operating Supply Voltage (typ): 3.3V
• Operating Temp Range: 0C to 85C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 64
• Lead Free Status / RoHS Status: Compliant

Figure 80.
13.9.3
Figure 81.
448
82574 Solder Paste
The stencil for the solder paste should be 5 mils thick. Also, use a solder paste alloy
consisting of 96.5Sn/3Ag/0.5Cu for a lead free process.
Landing Pattern A (No Via In Pad)
This landing pattern (vias outside Exposed Pad*) provides an extended ground
connection, adequate solder coverage and less solder voiding; however, it does not
provide thermal relief. This landing pattern also meets Intel’s recommendation for
coverage >= 80%.
82574 Landing Pattern A (Top View - Vias on the Outside of the Exposed
Pad*)
Use 12 vias distributed on four sides (three per side, as shown in
sides (four per side). Additional vias can be added to improve conductivity. If larger
vias can be used (14 to 20 mil finished hole size), then a minimum of 9 vias can be
evenly placed around the extended ground connection.
Metal Pattern
Extended Ground Connection
Without Thermal Relief
0.054 in. (1.38 mm) Square x 9
0.12 in.
0.30 mm
82574 GbE Controller—Design Considerations
0.12 in.
0.30 mm
Solder Mask Opening
Figure
81) or three