WG82574L S LBA8 Intel, WG82574L S LBA8 Datasheet - Page 433
WG82574L S LBA8
Manufacturer Part Number
WG82574L S LBA8
Description
Manufacturer
Intel
Datasheet
1.WG82574L_S_LBA8.pdf
(472 pages)
Specifications of WG82574L S LBA8
Operating Supply Voltage (typ)
3.3V
Operating Temp Range
0C to 85C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
64
Lead Free Status / RoHS Status
Compliant
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Design Considerations—82574 GbE Controller
Figure 69.
13.5.5.3
Layout for Discrete Magnetics
Board Stack-Up Recommendations
Printed circuit boards for these designs typically have four, six, eight, or more layers.
Although, the 82574 does not dictate the stack up, here is an example of a typical six-
layer board stack up:
This board stack up configuration can be adjusted to conform to specific OEM design
rules.
• Layer 1 is a signal layer. It can contain the differential analog pairs from the
• Layer 2 is a signal ground layer. Chassis ground may also be fabricated in Layer 2
• Layer 3 is used for power planes.
• Layer 4 is a signal layer.
• Layer 5 is an additional ground layer.
• Layer 6 is a signal layer. For 1000 BASE-T (copper) Gigabit designs, it is common to
Ethernet device to the magnetics module, or to an optical transceiver.
under the connector side of the magnetics module.
route two of the differential pairs (per port) on this layer.
RJ-45
Magnetics Module
82574L
433
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