PIC16F707-E/P Microchip Technology, PIC16F707-E/P Datasheet - Page 283

• Manufacturer Part Number: PIC16F707-E/P
• Description: 14KB Flash Program, MTouch, 32ch CSM, 1.8V-5.5V, 16MHz Internal Oscillator, 8b A
• Manufacturer: Microchip Technology
• Series: PIC® XLP™ 16Fr

Specifications of PIC16F707-E/P

• Core Processor: PIC
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 36
• Program Memory Size: 14KB (8K x 14)
• Program Memory Type: FLASH
• Ram Size: 363 x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 5.5 V
• Data Converters: A/D 14x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 40-DIP (0.600", 15.24mm)
• Processor Series: PIC16F
• Core: PIC
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office
 2010 Microchip Technology Inc.
Device:
Temperature
Range:
Package:
Pattern:
PART NO.
Device
Temperature
PIC16F707, PIC16LF707, PIC16F707T, PIC16LF707T
I
E
MV
ML
P
PT
3-Digit Pattern Code for QTP (blank otherwise)
Range
X
= -40C to +85C
= -40C to +125C
=
=
=
=
Micro Lead Frame (UQFN)
Micro Lead Frame (QFN)
Plastic DIP
TQFP (Thin Quad Flatpack)
Package
/XX
Pattern
XXX
Preliminary
PIC16F707/PIC16LF707
(1)
Examples:
a)
b)
Note 1:
PIC16F707-E/P 301 = Extended Temp., PDIP
package, QTP pattern #301
PIC16F707-I/ML = Industrial Temp., QFN
package
T
= In tape and reel.
.
DS41418A-page 283