ADSP-21469KBCZ-3 Analog Devices Inc, ADSP-21469KBCZ-3 Datasheet - Page 69

• Manufacturer Part Number: ADSP-21469KBCZ-3
• Description: 400MHz SHARC Processor W/5 Mbits Ram
• Manufacturer: Analog Devices Inc
• Series: SHARC®r
• Type: Floating Pointr

Specifications of ADSP-21469KBCZ-3

• Interface: DAI, DPI, EBI/EMI, I²C, SCI, SPI, SSP, UART/USART
• Clock Rate: 400MHz
• Non-volatile Memory: External
• On-chip Ram: 5Mb
• Voltage - I/o: 3.30V
• Voltage - Core: 1.05V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 324-BGA, 324-CSP
• Package: 324CSP-BGA
• Numeric And Arithmetic Format: Floating-Point
• Maximum Speed: 400 MHz
• Ram Size: 640 KB
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

OUTLINE DIMENSIONS
The ADSP-21469 processor is available in a 19 mm by 19 mm
CSP_BGA lead-free package.
SURFACE-MOUNT DESIGN
The following table is provided as an aid to PCB design. For
industry-standard design recommendations, refer to IPC-7351,
Generic Requirements for Surface-Mount Design and Land Pat-
tern Standard.
Package
324-Ball CSP_BGA (BC-324-1)
CORNER
A1 BALL
* 1.80
1.71
1.56
Figure 60. 324-Ball Chip Scale Package, Ball Grid Array [CSP_BGA]
DETAIL A
Package Ball Attach Type
Solder Mask Defined
TOP VIEW
19.10
19.00 SQ
18.90
* COMPLIANT TO JEDEC STANDARDS MO-192-AAG-1 WITH
THE EXCEPTION TO PACKAGE HEIGHT.
Rev. 0 | Page 69 of 72 | June 2010
Dimensions shown in millimeters
SEATING
(BC-324-1)
PLANE
BSC SQ
17.00
REF
1.00
BSC
1.00
DETAIL A
18
17
Package Solder Mask
Opening
0.43 mm diameter
BALL DIAMETER
16
15
14
BOTTOM VIEW
13
0.70
0.60
0.50
12
11
10
9
8
COPLANARITY
0.20
7
6
1.31
1.21
1.11
5
4
0.50 NOM
0.45 MIN
3
2
1
L
N
R
U
A
C
E
G
J
B
D
F
H
K
M
P
T
V
A1 BALL
CORNER
Package Ball Pad Size
0.6 mm diameter
ADSP-21469