R4F24269NVFQV Renesas Electronics America, R4F24269NVFQV Datasheet - Page 1323

MCU 256KB FLASH 64K 144-LQFP

R4F24269NVFQV

Manufacturer Part Number
R4F24269NVFQV
Description
MCU 256KB FLASH 64K 144-LQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2400r
Datasheet

Specifications of R4F24269NVFQV

Core Processor
H8S/2600
Core Size
16/32-Bit
Speed
33MHz
Connectivity
EBI/EMI, I²C, IrDA, SCI, SSU, UART/USART
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
96
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
64K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 10x10b, D/A 2x8b
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
144-LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
R4F24269NVFQV
Manufacturer:
Renesas Electronics America
Quantity:
135
Part Number:
R4F24269NVFQV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
H8S/2426, H8S/2426R, H8S/2424 Group
(4)
Table 25.34 DMAC and EXDMAC Timing
Conditions: V
REJ09B0466-0350 Rev. 3.50
Jul 09, 2010
Item
DREQ setup time
DREQ hold time
TEND delay time
DACK delay time 1
DACK delay time 2
EDREQ setup time
EDREQ hold time
ETEND delay time
EDACK delay time 1
EDACK delay time 2
EDRAK delay time
DMAC and EXDMAC Timing
φ = 8 MHz to 33 MHz
CC
= 4.5 V to 5.5 V, AV
Symbol
t
t
t
t
t
t
t
t
t
t
t
DRQS
DRQH
TED
DACD1
DACD2
EDRQS
EDRQH
ETED
EDACD1
EDACD2
EDRKD
CC
= 4.5 V to 5.5 V, V
Min.
25
10
25
10
Max.
18
18
18
18
18
18
18
ref
= 4.5 V to AV
Unit
ns
ns
ns
ns
ns
ns
Section 25 Electrical Characteristics
Test Conditions
Figure 25.70
Figure 25.69
Figures 25.67 and 25.68
Figure 25.70
Figure 25.69
Figures 25.67 and 25.68
Figure 25.71
CC
, V
SS
= AV
Page 1293 of 1372
SS
= 0 V,

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