R4F24269NVFQV Renesas Electronics America, R4F24269NVFQV Datasheet - Page 1289

MCU 256KB FLASH 64K 144-LQFP

R4F24269NVFQV

Manufacturer Part Number
R4F24269NVFQV
Description
MCU 256KB FLASH 64K 144-LQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2400r
Datasheet

Specifications of R4F24269NVFQV

Core Processor
H8S/2600
Core Size
16/32-Bit
Speed
33MHz
Connectivity
EBI/EMI, I²C, IrDA, SCI, SSU, UART/USART
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
96
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
64K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 10x10b, D/A 2x8b
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
144-LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
R4F24269NVFQV
Manufacturer:
Renesas Electronics America
Quantity:
135
Part Number:
R4F24269NVFQV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
H8S/2426, H8S/2426R, H8S/2424 Group
REJ09B0466-0350 Rev. 3.50
Jul 09, 2010
Read
Write
Note: DACK and EDACK timing: when DDS = 0 and EDDS = 0
EDACK2, EDACK3
DACK0, DACK1
φ
A23 to A0
RAS5 to RAS2
UCAS
LCAS
OE, RD
HWR
D15 to D0
OE, RD
HWR
D15 to D0
AS
RAS timing: when RAST = 0
Figure 25.15 DRAM Access Timing: Two-State Access
t
AD
Tp
t
t
AS3
PCH2
Tr
t
CSD2
t
t
t
DACD1
EDACD1
AH1
t
t
AD
t
WRD2
WDD
Tc1
t
t
t
t
AS2
OED1/
OED1B
AC4
t
WDS1
t
WCS1
t
AA3
t
t
WCH1
CASD1
t
AC1
Section 25 Electrical Characteristics
Tc2
t
WDH2
t
CASW1
t
AH2
t
RDS2
t
WRD2
t
RDH2
t
t
OED1/
OED1B
t
t
t
DACD2
EDACD2
CASD1
t
CSD3
Page 1259 of 1372

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