DF2506BR26DV Renesas Electronics America, DF2506BR26DV Datasheet - Page 79

• Manufacturer Part Number: DF2506BR26DV
• Description: IC H8S/2506 MCU FLASH 176-LFBGA
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2500r

Specifications of DF2506BR26DV

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 26MHz
• Connectivity: I²C, SCI
• Peripherals: POR, PWM, WDT
• Number Of I /o: 104
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 5.5 V
• Data Converters: A/D 16x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 176-LFBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

• Stack Structure
In advanced mode, when the program counter (PC) is pushed onto the stack in a subroutine
call, and the PC, condition-code register (CCR), and extended control register (EXR) are
pushed onto the stack in exception handling, they are stored as shown in figure 2.4. When
EXR is invalid, it is not pushed onto the stack. For details, see section 4, Exception Handling.
SP
Notes: 1. When EXR is not used it is not stored on the stack.
2. SP when EXR is not used.
3. Ignored when returning.
(a) Subroutine Branch
Figure 2.4 Stack Structure in Advanced Mode
Reserved
(24 bits)
PC
(SP
SP
*
2
)
Rev. 6.00 Sep. 24, 2009 Page 31 of 928
(b) Exception Handling
(24 bits)
EXR*
Reserved*
CCR
PC
1
1
*
3
REJ09B0099-0600
Section 2 CPU