DF2506BR26DV Renesas Electronics America, DF2506BR26DV Datasheet - Page 750

IC H8S/2506 MCU FLASH 176-LFBGA

DF2506BR26DV

Manufacturer Part Number
DF2506BR26DV
Description
IC H8S/2506 MCU FLASH 176-LFBGA
Manufacturer
Renesas Electronics America
Series
H8® H8S/2500r
Datasheets

Specifications of DF2506BR26DV

Core Processor
H8S/2000
Core Size
16-Bit
Speed
26MHz
Connectivity
I²C, SCI
Peripherals
POR, PWM, WDT
Number Of I /o
104
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 16x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
176-LFBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2506BR26DV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 20 Flash Memory
Rev. 6.00 Sep. 24, 2009 Page 702 of 928
REJ09B0099-0600
(Program end notice)
2
4
Wait for program data
Figure 20.8 Overview of Boot Mode State Transition Diagram
programming/erasing
(reset by boot mode)
Boot mode initiation
setting command
Wait for inquiry
3
command
Wait for
(Erasure end notice)
(Program selection
command reception)
user boot MAT erasure
All user MAT and
(Program data transmission)
H'00.......H'00 reception
(Bit rate adjustment)
Inquiry command response
Inquiry command reception
Read/check command
reception
H'00 transmission
(adjustment completed)
Command response
(Erasure selection command reception)
read/check command
Bit rate adjustment
Wait for erase-block
Processing of
inquiry setting
Processing of
command
data
(Erase-block specification)
1

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