DF2506BR26DV Renesas Electronics America, DF2506BR26DV Datasheet - Page 723

IC H8S/2506 MCU FLASH 176-LFBGA

DF2506BR26DV

Manufacturer Part Number
DF2506BR26DV
Description
IC H8S/2506 MCU FLASH 176-LFBGA
Manufacturer
Renesas Electronics America
Series
H8® H8S/2500r
Datasheets

Specifications of DF2506BR26DV

Core Processor
H8S/2000
Core Size
16-Bit
Speed
26MHz
Connectivity
I²C, SCI
Peripherals
POR, PWM, WDT
Number Of I /o
104
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 16x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
176-LFBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

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Part Number:
DF2506BR26DV
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Quantity:
10 000
5. When programming/erasing is executed consecutively
20.2
Table 20.3 shows the flash memory pin configuration.
Table 20.3 Pin Configuration
Note: For the pin configuration in programmer mode, see section 20.9, Programmer Mode.
Pin Name
Reset
Mode 2
Mode 1
Mode 0
Transmit data
Receive data
When the processing is not ended by the 128-byte programming or one-block erasure, the
program address/data and erase-block number must be updated and consecutive
programming/erasing is required.
Since the downloaded on-chip program is left in the on-chip RAM after the processing,
download and initialization are not required when the same processing is executed
consecutively.
Pin Configuration
Abbreviation
RES
MD2
MD1
MD0
TxD0
RxD0
Input/Output
Input
Input
Input
Input
Output
Input
Function
Reset
Sets operating mode of this LSI
Sets operating mode of this LSI
Sets operating mode of this LSI
Serial transmit data output (used in boot
mode)
Serial receive data input (used in boot mode)
Rev. 6.00 Sep. 24, 2009 Page 675 of 928
Section 20 Flash Memory
REJ09B0099-0600

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