LPC2478FBD208,551 NXP Semiconductors, LPC2478FBD208,551 Datasheet - Page 538

• Manufacturer Part Number: LPC2478FBD208,551
• Description: IC ARM7 MCU 512K LCD 208-LQFP
• Manufacturer: NXP Semiconductors
• Series: LPC2400r

Specifications of LPC2478FBD208,551

• Program Memory Type: FLASH
• Program Memory Size: 512KB (512K x 8)
• Package / Case: 208-LQFP
• Core Processor: ARM7
• Core Size: 16/32-Bit
• Speed: 72MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I²C, Microwire, MMC, SPI, SSI, SSP, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
• Number Of I /o: 160
• Ram Size: 96K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Processor Series: LPC24
• Core: ARM7TDMI-S
• Data Bus Width: 16 bit, 32 bit
• Data Ram Size: 98 KB
• Interface Type: CAN/I2C/I2S/IrDA/SPI/SSP/UART/USB
• Maximum Clock Frequency: 72 MHz
• Number Of Programmable I/os: 160
• Number Of Timers: 4
• Operating Supply Voltage: 3.3 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2, DK-35TS-LPC2478, DK-57TS-LPC2478, DK-57VTS-LPC2478, SOMDIMM-LPC2478, SAB-TFBGA208, KSK-LPC2478-JL, MCB2470
• Development Tools By Supplier: OM11015, OM11019, OM11022
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8-ch x 10-bit
• On-chip Dac: 1-ch x 10-bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 622-1034 - PROGRAMMERS, DEVELOPMENT SYSTEMS622-1033 - KIT LCD TOUCH 5.7" FOR LPC2478MCB2470 - BOARD EVAL NXP LPC247X SERIESOM11022 - EVAL LPC-STICK WITH LPC2478OM11019 - BOARD EVAL FOR LPC2478568-4742 - MODULE DIMM LPC2478 ARM7568-4741 - KIT LCD TOUCH 5.7" FOR LPC2478622-1028 - KIT LCD TOUCH 5.7" FOR LPC2478KSDKLPC2478-PL - KIT IAR KICKSTART NXP LPC2478622-1024 - BOARD SCKT ADAPTER FOR TFBGA208568-4369 - BOARD EVAL FOR LPC2478622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-4363; 935284069551; LPC2478FBD208-S

NXP Semiconductors
UM10237_4
User manual
Fig 96. Texas Instruments Synchronous Serial Frame Format: a) Single and b) Continuous/back-to-back Two
a. Single frame transfer
b. Continuous/back-to-back frames transfer
Frames Transfer
DX/DR
CLK
FS
5.2.1 Clock Polarity (CPOL) and Phase (CPHA) control
5.2 SPI frame format
For device configured as a master in this mode, CLK and FS are forced LOW, and the
transmit data line DX is tristated whenever the SSP is idle. Once the bottom entry of the
transmit FIFO contains data, FS is pulsed HIGH for one CLK period. The value to be
transmitted is also transferred from the transmit FIFO to the serial shift register of the
transmit logic. On the next rising edge of CLK, the MSB of the 4 to 16 bit data frame is
shifted out on the DX pin. Likewise, the MSB of the received data is shifted onto the DR
pin by the off-chip serial slave device.
Both the SSP and the off-chip serial slave device then clock each data bit into their serial
shifter on the falling edge of each CLK. The received data is transferred from the serial
shifter to the receive FIFO on the first rising edge of CLK after the LSB has been latched.
The SPI interface is a four-wire interface where the SSEL signal behaves as a slave
select. The main feature of the SPI format is that the inactive state and phase of the SCK
signal are programmable through the CPOL and CPHA bits within the SSPCR0 control
register.
When the CPOL clock polarity control bit is LOW, it produces a steady state low value on
the SCK pin. If the CPOL clock polarity control bit is HIGH, a steady state high value is
placed on the CLK pin when data is not being transferred.
DX/DR
CLK
FS
MSB
4 to 16 bits
Rev. 04 — 26 August 2009
MSB
LSB
4 to 16 bits
MSB
Chapter 20: LPC24XX SSP interface SSP0/1
LSB
4 to 16 bits
LSB
UM10237
© NXP B.V. 2009. All rights reserved.
538 of 792