LPC2478FBD208,551 NXP Semiconductors, LPC2478FBD208,551 Datasheet - Page 136
![IC ARM7 MCU 512K LCD 208-LQFP](/photos/12/13/121391/208-lqfp_sot459-1_pkg_sml.jpg)
LPC2478FBD208,551
Manufacturer Part Number
LPC2478FBD208,551
Description
IC ARM7 MCU 512K LCD 208-LQFP
Manufacturer
NXP Semiconductors
Series
LPC2400r
Datasheets
1.OM11077.pdf
(91 pages)
2.OM11077.pdf
(792 pages)
3.OM11077.pdf
(10 pages)
4.LPC2478FBD208551.pdf
(89 pages)
Specifications of LPC2478FBD208,551
Program Memory Type
FLASH
Program Memory Size
512KB (512K x 8)
Package / Case
208-LQFP
Core Processor
ARM7
Core Size
16/32-Bit
Speed
72MHz
Connectivity
CAN, EBI/EMI, Ethernet, I²C, Microwire, MMC, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
Number Of I /o
160
Ram Size
96K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
LPC24
Core
ARM7TDMI-S
Data Bus Width
16 bit, 32 bit
Data Ram Size
98 KB
Interface Type
CAN/I2C/I2S/IrDA/SPI/SSP/UART/USB
Maximum Clock Frequency
72 MHz
Number Of Programmable I/os
160
Number Of Timers
4
Operating Supply Voltage
3.3 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2, DK-35TS-LPC2478, DK-57TS-LPC2478, DK-57VTS-LPC2478, SOMDIMM-LPC2478, SAB-TFBGA208, KSK-LPC2478-JL, MCB2470
Development Tools By Supplier
OM11015, OM11019, OM11022
Minimum Operating Temperature
- 40 C
On-chip Adc
8-ch x 10-bit
On-chip Dac
1-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
622-1034 - PROGRAMMERS, DEVELOPMENT SYSTEMS622-1033 - KIT LCD TOUCH 5.7" FOR LPC2478MCB2470 - BOARD EVAL NXP LPC247X SERIESOM11022 - EVAL LPC-STICK WITH LPC2478OM11019 - BOARD EVAL FOR LPC2478568-4742 - MODULE DIMM LPC2478 ARM7568-4741 - KIT LCD TOUCH 5.7" FOR LPC2478622-1028 - KIT LCD TOUCH 5.7" FOR LPC2478KSDKLPC2478-PL - KIT IAR KICKSTART NXP LPC2478622-1024 - BOARD SCKT ADAPTER FOR TFBGA208568-4369 - BOARD EVAL FOR LPC2478622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-4363
935284069551
LPC2478FBD208-S
935284069551
LPC2478FBD208-S
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LPC2478FBD208,551
Manufacturer:
NXP Semiconductors
Quantity:
10 000
Part Number:
LPC2478FBD208,551
Manufacturer:
NXP/恩智浦
Quantity:
20 000
- OM11077 PDF datasheet
- OM11077 PDF datasheet #2
- OM11077 PDF datasheet #3
- LPC2478FBD208551 PDF datasheet #4
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- Download datasheet (5Mb)
NXP Semiconductors
Table 120. Pin description
[1]
[2]
[3]
[4]
[5]
[6]
[7]
[8]
[9]
[10] Pad provides special analog functionality.
[11] Pad provides special analog functionality.
[12] Pad provides special analog functionality.
[13] Pad provides special analog functionality.
[14] Pad provides special analog functionality.
UM10237_4
User manual
Symbol
V
V
V
V
n.c.
V
V
VREF
VBAT
SSIO
SSCORE
SSA
DD(3V3)
DD(DCDC)(3V3)
DDA
5 V tolerant pad providing digital I/O functions with TTL levels and hysteresis.
5 V tolerant pad providing digital I/O functions (with TTL levels and hysteresis) and analog input. When configured as a ADC input,
digital section of the pad is disabled.
5 V tolerant pad providing digital I/O with TTL levels and hysteresis and analog output function. When configured as the DAC output,
digital section of the pad is disabled.
Open-drain 5 V tolerant digital I/O pad, compatible with I
functionality. When power is switched off, this pin connected to the I
configuration applies to all functions on this pin.
Pad provides digital I/O and USB functions. It is designed in accordance with the USB specification, revision 2.0 (Full-speed and
Low-speed mode only).
5 V tolerant pad with 5 ns glitch filter providing digital I/O functions with TTL levels and hysteresis.
5 V tolerant pad with 20 ns glitch filter providing digital I/O function with TTL levels and hysteresis.
Pad provides special analog functionality.
Pad provides special analog functionality.
Ball
H4, P4,
L9, L13,
G13,
D13,
C11,
B4
H3, L8,
A10
F3
E2, L4,
K8, L11,
J14, E12,
E10,
C5
H1, L12,
G10
G1, N9,
E9
F2
G2
K1
[10]
[14]
[9]
[13]
[14]
[11]
[14]
[9]
[12]
…continued
Type
I
I
I
I
I
I
I
I
I
Description
ground: 0 V reference for the digital IO pins.
ground: 0 V reference for the core.
analog ground: 0 V reference. This should nominally be the same voltage as
V
3.3 V supply voltage: This is the power supply voltage for the I/O ports.
not connected pins: These pins must be left unconnected (floating).
3.3 V DC-to-DC converter supply voltage: This is the power supply for the
on-chip DC-to-DC converter.
analog 3.3 V pad supply voltage: This should be nominally the same voltage as
V
to power the ADC and DAC.
ADC reference: This should be nominally the same voltage as V
should be isolated to minimize noise and error. The level on this pin is used as a
reference for ADC and DAC.
RTC power supply: 3.3 V on this pin supplies the power to the RTC peripheral.
SSIO
DD(3V3)
/V
Rev. 04 — 26 August 2009
SSCORE
but should be isolated to minimize noise and error. This voltage is used
2
C-bus 400 kHz specification. It requires an external pull-up to provide output
, but should be isolated to minimize noise and error.
2
C-bus is floating and does not disturb the I
Chapter 8: LPC24XX Pin configuration
UM10237
2
© NXP B.V. 2009. All rights reserved.
C lines. Open-drain
DD(3V3)
but
136 of 792
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