LPC2478FBD208,551 NXP Semiconductors, LPC2478FBD208,551 Datasheet - Page 527

IC ARM7 MCU 512K LCD 208-LQFP

LPC2478FBD208,551

Manufacturer Part Number
LPC2478FBD208,551
Description
IC ARM7 MCU 512K LCD 208-LQFP
Manufacturer
NXP Semiconductors
Series
LPC2400r
Datasheets

Specifications of LPC2478FBD208,551

Program Memory Type
FLASH
Program Memory Size
512KB (512K x 8)
Package / Case
208-LQFP
Core Processor
ARM7
Core Size
16/32-Bit
Speed
72MHz
Connectivity
CAN, EBI/EMI, Ethernet, I²C, Microwire, MMC, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
Number Of I /o
160
Ram Size
96K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
LPC24
Core
ARM7TDMI-S
Data Bus Width
16 bit, 32 bit
Data Ram Size
98 KB
Interface Type
CAN/I2C/I2S/IrDA/SPI/SSP/UART/USB
Maximum Clock Frequency
72 MHz
Number Of Programmable I/os
160
Number Of Timers
4
Operating Supply Voltage
3.3 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2, DK-35TS-LPC2478, DK-57TS-LPC2478, DK-57VTS-LPC2478, SOMDIMM-LPC2478, SAB-TFBGA208, KSK-LPC2478-JL, MCB2470
Development Tools By Supplier
OM11015, OM11019, OM11022
Minimum Operating Temperature
- 40 C
On-chip Adc
8-ch x 10-bit
On-chip Dac
1-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
622-1034 - PROGRAMMERS, DEVELOPMENT SYSTEMS622-1033 - KIT LCD TOUCH 5.7" FOR LPC2478MCB2470 - BOARD EVAL NXP LPC247X SERIESOM11022 - EVAL LPC-STICK WITH LPC2478OM11019 - BOARD EVAL FOR LPC2478568-4742 - MODULE DIMM LPC2478 ARM7568-4741 - KIT LCD TOUCH 5.7" FOR LPC2478622-1028 - KIT LCD TOUCH 5.7" FOR LPC2478KSDKLPC2478-PL - KIT IAR KICKSTART NXP LPC2478622-1024 - BOARD SCKT ADAPTER FOR TFBGA208568-4369 - BOARD EVAL FOR LPC2478622-1005 - USB IN-CIRCUIT PROG ARM7 LPC2K
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-4363
935284069551
LPC2478FBD208-S

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NXP Semiconductors
UM10237_4
User manual
Fig 94. SPI data transfer format (CPHA = 0 and CPHA = 1)
Cycle # CPHA = 0
Cycle # CPHA = 1
MOSI (CPHA = 0)
MISO (CPHA = 0)
MOSI (CPHA = 1)
MISO (CPHA = 1)
SCK (CPOL = 0)
SCK (CPOL = 1)
CPHA = 0
CPHA = 1
SSEL
The data and clock phase relationships are summarized in
summarizes the following for each setting of CPOL and CPHA.
Table 459. SPI Data To Clock Phase Relationship
The definition of when an 8 bit transfer starts and stops is dependent on whether a device
is a master or a slave, and the setting of the CPHA variable.
When a device is a master, the start of a transfer is indicated by the master having a byte
of data that is ready to be transmitted. At this point, the master can activate the clock, and
begin the transfer. The transfer ends when the last clock cycle of the transfer is complete.
CPOL and CPHA settings First data driven
CPOL = 0, CPHA = 0
CPOL = 0, CPHA = 1
CPOL = 1, CPHA = 0
CPOL = 1, CPHA = 1
When the first data bit is driven.
When all other data bits are driven.
When data is sampled.
BIT 1
BIT 1
1
BIT 1
BIT 1
1
BIT 2
BIT 2
2
BIT 2
BIT 2
Rev. 04 — 26 August 2009
2
BIT 3
BIT 3
3
Prior to first SCK rising edge SCK falling edge
First SCK rising edge
Prior to first SCK falling edge SCK rising edge
First SCK falling edge
BIT 3
BIT 3
3
BIT 4
BIT 4
4
BIT 4
BIT 4
4
BIT 5
BIT 5
5
BIT 5
BIT 5
5
BIT 6
BIT 6
6
BIT 6
BIT 6
6
Other data driven Data sampled
SCK rising edge
SCK falling edge
BIT 7
BIT 7
7
BIT 7
BIT 7
Table
7
Chapter 19: LPC24XX SPI
BIT 8
BIT 8
8
19–459. This table
BIT 8
BIT 8
8
UM10237
© NXP B.V. 2009. All rights reserved.
SCK rising edge
SCK falling edge
SCK falling edge
SCK rising edge
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