AT32AP7001-ALUT Atmel, AT32AP7001-ALUT Datasheet - Page 795

IC MCU 32BIT AVR32 208-LQFP

AT32AP7001-ALUT

Manufacturer Part Number
AT32AP7001-ALUT
Description
IC MCU 32BIT AVR32 208-LQFP
Manufacturer
Atmel
Series
AVR®32 AP7r
Datasheets

Specifications of AT32AP7001-ALUT

Core Processor
AVR
Core Size
32-Bit
Speed
150MHz
Connectivity
EBI/EMI, I²C, MMC, PS2, SPI, SSC, UART/USART, USB
Peripherals
AC'97, DMA, I²C, POR, PWM, WDT
Number Of I /o
90
Program Memory Type
ROMless
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
1.65 V ~ 1.95 V
Data Converters
D/A 2x16b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
208-LQFP
Data Bus Width
32 bit
Data Ram Size
32 KB
Interface Type
EBI, ISI, MCI, PS2, SPI, TWI, USB
Maximum Clock Frequency
150 MHz
Number Of Programmable I/os
90
Number Of Timers
3
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
On-chip Dac
16 bit, 1 Channel
Package
208PQFP
Device Core
AVR32
Family Name
AT32
Maximum Speed
150 MHz
Operating Supply Voltage
1.8 V
For Use With
ATAVRONEKIT - KIT AVR/AVR32 DEBUGGER/PROGRMMRATNGW100 - KIT AVR32 NETWORK GATEWAYATSTK1000 - KIT STARTER FOR AVR32AP7000
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Lead Free Status / Rohs Status
 Details

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
AT32AP7001-ALUT
Manufacturer:
EVERLIGHT
Quantity:
12 000
Part Number:
AT32AP7001-ALUT
Manufacturer:
Atmel
Quantity:
10 000
Table 39-2.
Table 39-3.
Table 39-4.
Table 39-5.
39.1.3
Table 39-6.
32015G–AVR32–09/09
Pin Land
2850
Moisture Sensitivity Level
JEDEC Drawing Reference
JESD97 Classification
Profile Feature
Average Ramp-up Rate (217°C to Peak)
Preheat Temperature 175°C ±25°C
Temperature Maintained Above 217°C
Time within 5°C of Actual Peak Temperature
Peak Temperature Range
Ramp-down Rate
Time 25°C to Peak Temperature
Soldering Profile
Soldering Information
Device and 208-QFP Package Maximum Weight
208-QFP Package Characteristics
Package Reference
Soldering Profile
Table 38-6
Note:
It is recommended to apply a soldering temperature higher than 250°C. A maximum of three
reflow passes is allowed per component.
gives the recommended soldering profile from J-STD-20.
mg
0.29 x 1.35 mm
3
MS-029
e3
Green Package
3°C/sec
60 - 180 sec
60 - 150 sec
20 - 40 sec
260 + 0°C
6°C/sec max
8 minuts max
AT32AP7001
795

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