MT48H8M16LFB4-10 Micron Technology Inc, MT48H8M16LFB4-10 Datasheet - Page 64

• Manufacturer Part Number: MT48H8M16LFB4-10
• Description: IC SDRAM 128MBIT 100MHZ 54VFBGA
• Manufacturer: Micron Technology Inc

Specifications of MT48H8M16LFB4-10

• Format - Memory: RAM
• Memory Type: Mobile SDRAM
• Memory Size: 128M (8Mx16)
• Speed: 100MHz
• Interface: Parallel
• Voltage - Supply: 1.7 V ~ 1.9 V
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 54-VFBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Package Dimensions
Figure 50: 54-Ball FBGA (8mm x 8mm)
PDF: 09005aef80c97087/Source: 09005aef80c97015
MT48H8M16_2.fm - Rev. E 3/05 EN
This data sheet contains minimum and maximum limits specified over the complete power supply and temperature range
54X Ø0.45 ±0.05
SEATING PLANE
SOLDER BALL
DIAMETER REFERS
TO POST REFLOW
CONDITION. THE PRE-
REFLOW DIAMETER
IS 0.42.
for production devices. Although considered final, these specifications are subject to change, as further product
6.40
3.20 ±0.05
0.10 C
BALL A9
Micron, the M logo, and the Micron logo are trademarks of Micron Technology, Inc.
[e-mail] www.micron.com Customer Comment Line: 800-932-4992
Notes: 1. All dimensions are in millimeters.
0.65 ±0.05
C
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: [phone]
All other trademarks are the property of their respective owners.
3.20 ±0.05
development and data characterization sometimes occur.
8.00 ±0.10
6.40
C L
0.80
TYP
4.00 ±0.05
0.80 TYP
C L
BALL A1
BALL A1 ID
64
4.00 ±0.05
®
8.00 ±0.10
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1.00 MAX
128Mb: x16 – Mobile SDRAM
SOLDER BALL MATERIAL:
SOLDER MASK DEFINED BALL PADS: Ø0.40
SUBSTRATE MATERIAL: PLASTIC LAMINATE
MOLD COMPOUND: EPOXY NOVOLAC
62% Sn, 36% Pb, 2% Ag
96.5% Sn, 3% Ag, 0.5% Cu
Package Dimensions
©2003 Micron Technology, Inc. All rights reserved.
OR
BALL A1 ID