AMD-K6-2E/400AFR AMD [Advanced Micro Devices], AMD-K6-2E/400AFR Datasheet - Page 307

• Manufacturer Part Number: AMD-K6-2E/400AFR
• Manufacturer: AMD [Advanced Micro Devices]

22529B/0—January 2000
16.3
Example Heatsinks
Chapter 16
Sample Heatsink Measured Data
Figure 101. Measuring Case Temperature
The example measured data (provided in tables 69 through 72
and figures 105 through 108) shows case-to-ambient thermal
resistance and maximum ambient temperature for both
socketed and soldered processors using three passive heatsink
samples with different height profiles (see Table 68) and
different levels of airflow in the system. This data is based on
the following specification assumptions:
Note: AMD does not guarantee the example measured heatsink
Table 68 describes the three heatsinks tested. Figure 102,
Figure 103, and Figure 104 show the actual heatsinks.
Table 68. Passive Heatsink Samples
Identifier
T
P
q
T
T
CA
C
d
A(MAX)
A(MAX)
A
B
C
= 85°C = T
= 10 W
= q
data provided in tables 69 through 72 and figures 105
through 108. This data is supplied for informational
purposes only to facilitate the selection of an appropriate
thermal solution.
SA
= T
= 85 - (q
Size X (mm)
+ q
C(MAX)
Thermal Design
52
52
50
IF
C(MAX)
– (q
SA
+ q
for 1.9-V low-power K6-2E processors
Size Y (mm)
CA
IF
·P
)·P
50
50
50
d
)
d
Thermally Conductive Epoxy
Size Z Height (mm)
AMD-K6™-2E Processor Data Sheet
15
20
30
Thermocouple
289