MT48H8M32LFB5-10:G Micron Technology Inc, MT48H8M32LFB5-10:G Datasheet - Page 47

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MT48H8M32LFB5-10:G

Manufacturer Part Number
MT48H8M32LFB5-10:G
Description
Manufacturer
Micron Technology Inc
Type
Mobile SDRAMr
Datasheet

Specifications of MT48H8M32LFB5-10:G

Organization
8Mx32
Density
256Mb
Address Bus
14b
Access Time (max)
17/8/7ns
Maximum Clock Rate
104MHz
Operating Supply Voltage (typ)
1.8V
Package Type
VFBGA
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
1.9V
Operating Supply Voltage (min)
1.7V
Supply Current
65mA
Pin Count
90
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / Rohs Status
Compliant
NOTE:
pdf: 09005aef80d460f2, source: 09005aef80cd8d41
256Mb SDRAM x32_2.fm - Rev. D 9/04 EN
1. For this example, the burst length = 4, the CAS latency = 2, and the READ burst is followed by a “manual” PRECHARGE.
2. A9 and A11 = “Don’t Care.”
3. PRECHARGE command not allowed or tRAS would be violated.
See Table 14, Electrical Characteristics and Recommended AC Operating Conditions, on page 35.
DQMU, DQML
COMMAND
A0-A9, A11
BA0, BA1
CLK
CKE
A10
DQ
t CMS
t CKS
t AS
t AS
t AS
ACTIVE
ROW
ROW
BANK
T0
t CMH
t CKH
t AH
t AH
t AH
Figure 38: Single Read – Without Auto Precharge
t RCD
t RAS
t RC
t CK
T1
NOP
DISABLE AUTO PRECHARGE
t CMS
t CL
COLUMN m
BANK
T2
READ
t CMH
t CH
CAS Latency
2
T3
NOP
t LZ
3
t AC
47
T4
D
NOP
OUT
t OH
t HZ
3
m
Micron Technology, Inc., reserves the right to change products or specifications without notice.
SINGLE BANKS
PRECHARGE
ALL BANKS
BANK(S)
T5
t RP
T6
NOP
MOBILE SDRAM
ACTIVE
ROW
T7
ROW
BANK
©2003 Micron Technology, Inc. All rights reserved.
1
256Mb: x32
PRELIMINARY
T8
NOP
DON’T CARE
UNDEFINED

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