C8051T630DK Silicon Laboratories Inc, C8051T630DK Datasheet - Page 22

• Manufacturer Part Number: C8051T630DK
• Description: KIT DEV FOR C8051T630 FAMILY
• Manufacturer: Silicon Laboratories Inc
• Type: MCUr

Specifications of C8051T630DK

• Contents: Board, daughter boards, power adapter, cables, documentation and software
• Processor To Be Evaluated: C8051T63x
• Interface Type: USB
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With/related Products: C8051T630, T631, T632, T633, T634 and T635 MCUs
• For Use With: 336-1465 - BOARD SOCKET DAUGHTER 20-QFN
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 336-1464

C8051T630/1/2/3/4/5
22
Notes:
General
Solder Mask Design
Stencil Design
Card Assembly
Dimension
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification.
3. This Land Pattern Design is based on the IPC-7351 guidelines.
4. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder
5. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used
6. The stencil thickness should be 0.125mm (5 mils).
7. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pins.
8. A 2x2 array of 0.95mm openings on a 1.1mm pitch should be used for the center pad to
9. A No-Clean, Type-3 solder paste is recommended.
10. The recommended card reflow profile is per the JEDEC/IPC J-STD-020C specification for
C1
C2
X1
E
mask and the metal pad is to be 60m minimum, all the way around the pad.
to assure good solder paste release.
assure the proper paste volume (71% Paste Coverage).
Small Body Components.
Figure 4.2. QFN-20 Recommended PCB Land Pattern
Table 4.2. QFN-20 PCB Land Pattern Dimesions
0.20
Min
3.70
3.70
0.50
Max
0.30
Rev. 1.0
Dimension
X2
Y1
Y2
2.15
0.90
2.15
Min
Max
2.25
1.00
2.25