or3l165b Lattice Semiconductor Corp., or3l165b Datasheet - Page 84
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or3l165b
Manufacturer Part Number
or3l165b
Description
Orca Or3lxxxb Series Field-programmable Gate Arrays
Manufacturer
Lattice Semiconductor Corp.
Datasheet
1.OR3L165B.pdf
(88 pages)
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Quantity
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ORCA OR3LxxxB Series FPGAs
Package Outline Diagrams
352-Pin PBGA
Dimensions are in millimeters.
84
Note: Although the 36 thermal enhancement balls are stated as an option, they are standard on the 352 FPGA package.
(SEE NOTE BELOW)
IDENTIFIER ZONE
CENTER ARRAY
ENHANCEMENT
FOR THERMAL
(OPTIONAL)
COMPOUND
CORNER
A1 BALL
A1 BALL
MOLD
PWB
0.60 ± 0.10
0.56 ± 0.06
AF
AE
AD
AC
AB
AA
W
M
G
Y
V
U
T
R
P
N
K
H
F
E
D
C
B
A
L
J
1 2 3 4 5 6 7 8 9 10
(continued)
25 SPACES @ 1.27 = 31.75
35.00 ± 0.20
30.00
11 13
12
14 16
+0.70
–0.00
15
17
SOLDER BALL
18
19
20
21
22
23
1.17 ± 0.05
24
25
26
30.00
0.75 ± 0.15
@ 1.27 = 31.75
+0.70
–0.00
25 SPACES
2.33 ± 0.21
SEATING PLANE
35.00
± 0.20
0.20
Lattice Semiconductor
Data Addendum
March 2002
5-4407(F)