or3l165b Lattice Semiconductor Corp., or3l165b Datasheet - Page 79

• Manufacturer Part Number: or3l165b
• Description: Orca Or3lxxxb Series Field-programmable Gate Arrays
• Manufacturer: Lattice Semiconductor Corp.

Data Addendum
March 2002
Lattice Semiconductor
Package Thermal Characteristics
FPGA Maximum Junction Temperature
Once the power dissipated by the FPGA has been determined (see the Estimating Power Dissipation section), the
maximum junction temperature of the FPGA can be found. This is needed to determine if speed derating of the
device from the 85 °C junction temperature used in all of the delay tables is needed. Using the maximum ambient
temperature, T
ture is approximated by the following:
Table 32 lists the plastic package thermal characteristics for the ORCA Series FPGAs.
Table 32. Plastic Package Thermal Characteristics for the ORCA Series
1. Mounted on 4-layer JEDEC standard test board with two power/ground planes.
2. With thermal balls connected to board ground plane.
3. Without thermal balls connected to board ground plane.
208-Pin SQFP2
240-Pin SQFP2
352-Pin PBGA
352-Pin PBGA
432-Pin EBGA
680-Pin PBGAM1
Package
Amax
1, 2
1, 3
1
1
1
, and the power dissipated by the device, Q (expressed in °C), the maximum junction tempera-
0 fpm
12.8
13.0
19.0
25.5
11.0
14.5
200 fpm
T
Θ
Jmax =
TBD
10.3
10.0
16.0
22.0
JA
(continued)
8.5
(°C/W)
T
Amax
+ (Q
500 fpm
TBD
15.0
20.5
×
9.1
9.0
7.5
Θ
JA
)
ORCA OR3LxxxB Series FPGAs
1
T
T
J
A
at 0 fpm (W)
= 125 °C max
= 70 °C max
4.3
4.2
2.9
2.1
5.0
3.8
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