or3l165b Lattice Semiconductor Corp., or3l165b Datasheet - Page 2

• Manufacturer Part Number: or3l165b
• Description: Orca Or3lxxxb Series Field-programmable Gate Arrays
• Manufacturer: Lattice Semiconductor Corp.

Contents
ORCA OR3LxxxB Series FPGAs
Introduction................................................................ 1
Features .................................................................... 1
System-Level Features.............................................. 4
Support...................................................................... 5
Description ................................................................ 5
Timing Characteristics ............................................. 12
2
FPGA Overview ...................................................... 5
PLC Logic ............................................................... 5
PIC Logic ................................................................ 8
System Features ..................................................... 9
Routing.................................................................... 9
Configuration........................................................... 9
Configuration Data Format...................................... 9
Series 3L I/Os and 5 V Tolerance......................... 10
Designing with ORCA Series 3T Parts with
Powerup Sequencing for Series 3L Devices......... 10
ORCA Foundry Development System .................. 11
Additional Information ........................................... 11
Configuration Timing............................................. 12
PFU Timing ........................................................... 13
PLC Timing ........................................................... 19
SLIC Timing .......................................................... 19
PIO Timing ............................................................ 20
Special Function Blocks Timing ............................ 23
Clock Timing ......................................................... 25
Description ............................................................ 35
Series 3L in Mind................................................ 10
Table of Contents
Page
Contents
Estimating Power Dissipation................................. 37
Pin Information ....................................................... 38
Absolute Maximum Ratings.................................... 76
Recommended Operating Conditions .................... 76
Electrical Characteristics ........................................ 77
Package Thermal Characteristics .......................... 78
Package Coplanarity .............................................. 80
Package Parasitics................................................. 80
Package Outline Diagrams..................................... 81
Ordering Information .............................................. 87
OR3LxxxB............................................................ 37
Θ
ψ
Θ
Θ
FPGA Maximum Junction Temperature .............. 79
Terms and Definitions .......................................... 81
208-Pin SQFP2.................................................... 82
240-Pin SQFP2.................................................... 83
352-Pin PBGA ..................................................... 84
432-Pin EBGA ..................................................... 85
680-Pin PBGAM .................................................. 86
JC
JA
JC
JB
...................................................................... 78
...................................................................... 78
...................................................................... 78
...................................................................... 78
Lattice Semiconductor
Data Addendum
March 2002
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