SAM9G20 Atmel Corporation, SAM9G20 Datasheet - Page 799

• Manufacturer Part Number: SAM9G20
• Manufacturer: Atmel Corporation

Specifications of SAM9G20

• Flash (kbytes): 0 Kbytes
• Pin Count: 217
• Max. Operating Frequency: 400 MHz
• Cpu: ARM926
• Hardware Qtouch Acquisition: No
• Max I/o Pins: 96
• Ext Interrupts: 96
• Usb Transceiver: 3
• Usb Speed: Full Speed
• Usb Interface: Host, Device
• Spi: 2
• Twi (i2c): 1
• Uart: 7
• Ssc: 1
• Ethernet: 1
• Sd / Emmc: 1
• Graphic Lcd: No
• Video Decoder: No
• Camera Interface: Yes
• Adc Channels: 4
• Adc Resolution (bits): 10
• Adc Speed (ksps): 95
• Resistive Touch Screen: No
• Temp. Sensor: No
• Crypto Engine: No
• Sram (kbytes): 32
• Self Program Memory: NO
• External Bus Interface: 1
• Dram Memory: sdram
• Nand Interface: Yes
• Picopower: No
• Temp. Range (deg C): -40 to 85
• I/o Supply Class: 1.8/3.3
• Operating Voltage (vcc): 0.9 to 1.1
• Fpu: No
• Mpu / Mmu: No/Yes
• Timers: 6
• Output Compare Channels: 6
• Input Capture Channels: 6
• 32khz Rtc: Yes
• Calibrated Rc Oscillator: No

Table 42-7.
Table 42-8.
Table 42-9.
Table 42-10. Package Reference
42.2.1
6384E–ATARM–05-Feb-10
Ball Land
Solder Mask Opening
177
Moisture Sensitivity Level
JEDEC Drawing Reference
JESD97 Classification
Soldering Profile
Soldering Information
Device and 247-ball TFBGA Package Maximum Weight
247-ball TFBGA Package Characteristics
Table 42-5
Table 42-11. Soldering Profile
Note:
Profile Feature
Average Ramp-up Rate (217°C to Peak)
Preheat Temperature 175°C ±25°C
Temperature Maintained Above 217°C
Time within 5° C of Actual Peak Temperature
Peak Temperature Range
Ramp-down Rate
Time 25° C to Peak Temperature
It is recommended to apply a soldering temperature higher than 250°C.
reflow passes is allowed per component.
gives the recommended soldering profile from J-STD-20.
mg
0.35 mm ± 0.05
0.27 mm ± 0.05
3
none
e1
Green Package
3° C/sec. max.
180 sec. max.
60 sec. to 150 sec.
20 sec. to 40 sec.
260 +0 ° C
6° C/sec. max.
8 min. max.
AT91SAM9G20
A maximum of three
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