N25Q064A13EF640F Micron Technology Inc, N25Q064A13EF640F Datasheet - Page 147

• Manufacturer Part Number: N25Q064A13EF640F
• Manufacturer: Micron Technology Inc

Specifications of N25Q064A13EF640F

• Lead Free Status / Rohs Status: Supplier Unconfirmed

N25Q064 - 3 V
16
Table 39.
1. Additional secure options are available upon customer request. For security features options, refer to AN:309025
Note:
Example:
Device type
N25Q = serial Flash memory, Quad I/O, XiP
Device density
064 = 064 Mbit
Technology
A = 65 nm
Feature set
1 = Byte addressability, Hold pin, Numonyx XiP
2 = Byte addressability, Hold pin, Basic XiP
3 = Byte addressability, Reset pin, Numonyx XiP
4 = Byte addressability, Reset pin, Basic XiP
Operating voltage
3 = VCC = 2.7 V to 3.6 V
Block Structure
E = Uniform (Uniform 4kB sub-sector erase and Uniform
64kB sector erase)
Package
F6 = VDFPN8 6 x 5 mm (MLP8)
F8 = VDFPN8 8 x 6 mm (MLP8)
SE = SO8W (SO8 Wide 208 mils body width)
SF = SO16W (SO16 Wide 300 mils body width)
12 = TBGA24 6 x 8 mm
Temperature and test flow
4 = Industrial temperature range, –40 to 85 °C; Device tested with standard test flow
A = Automotive temperature range, –40 to 125 °C; Device tested with high reliability
certified test flow
H = Industrial temperature range, –40 to 85 °C; Tested with high reliability
certified test flow
Security features
0 = No extra security
Packing options
E = Tray packing
F = Tape and reel packing
G = Tube packing
Ordering information
Ordering information scheme
All packages are RoHS compliant
(1)
N25Q064
Micron Technology, Inc., reserves the right to change products or specifications without notice.
A 1
3
E
©2010 Micron Technology, Inc. All rights reserved.
F8
Ordering information
4 0
E
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