TMOV25SP385M Littelfuse Inc, TMOV25SP385M Datasheet - Page 52

• Manufacturer Part Number: TMOV25SP385M
• Description: TMOV VARISTOR PB FREE 25S
• Manufacturer: Littelfuse Inc
• Series: iTMOV®r

Specifications of TMOV25SP385M

• Varistor Voltage: 682V
• Current-surge: 20kA
• Number Of Circuits: 1
• Maximum Ac Volts: 385VAC
• Energy: 430J
• Package / Case: Disc 25mm 3-Lead
• Suppressor Type: Varistor
• Peak Surge Current @ 8/20µs: 20000A
• Varistor Case: 25mm DISC
• Clamping Voltage Vc Max: 1010V
• Peak Energy (10/1000us): 430J
• Voltage Rating Vdc: 682V
• Voltage Rating Vac: 385V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Maximum Dc Volts: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

MLN SurgeArray™ Suppressor
Lead (Pb) Soldering Recommendations
The principal techniques used for the soldering of
components in surface mount technology are IR Re-flow
and Wave soldering. Typical profiles are shown on the right.
The recommended solder for the MLN suppressor is
a 62/36/2 (Sn/Pb/Ag), 60/40 (Sn/Pb) or 63/37 (Sn/Pb).
Littelfuse also recommends an RMA solder flux.
Wave soldering is the most strenuous of the processes.
To avoid the possibility of generating stresses due to
thermal shock, a preheat stage in the soldering process
is recommended, and the peak temperature of the solder
process should be rigidly controlled.
When using a reflow process, care should be taken to
ensure that the MLN chip is not subjected to a thermal
gradient steeper than 4 degrees per second; the ideal
gradient being 2 degrees per second. During the soldering
process, preheating to within 100 degrees of the solder's
peak temperature is essential to minimize thermal shock.
Once the soldering process has been completed, it is
still necessary to ensure that any further thermal shocks
are avoided. One possible cause of thermal shock is hot
printed circuit boards being removed from the solder
process and subjected to cleaning solvents at room
temperature. The boards must be allowed to cool gradually
to less than 50ºC before cleaning.
Surface Mount Multilayer Varistors (MLVs) > MLN Series
Revision: November 5, 2009
Varistor Products
48
Figure 10
Reflow Solder Profile
Wave Solder Profile
Figure 11
250
200
100
150
300
250
200
150
100
50
50
0
0
0
0.0
Please refer to www.littelfuse.com/series/MLN.html for current information.
0.5
0.5
PREHEAT ZONE
1.0
1.0
PREHEAT DWELL
FIRST PREHEAT
MAXIMUM TEMPERATURE
1.5
1.5
TIME (MINUTES)
MAXIMUM WAVE 260°C
TIME (MINUTES)
2.0
Specifications are subject to change without notice.
230°C
2.0
SECOND PREHEAT
RAMP RATE
<2°C/s
2.5
2.5
ABOVE 183°C
SECONDS
3.0
40-80
3.0
3.5
3.5
4.0
©2009 Littelfuse, Inc.
4.0
4.5