D12312SVTEBL25 Renesas Electronics America, D12312SVTEBL25 Datasheet - Page 820

IC H8S MCU ROMLESS 100-QFP

D12312SVTEBL25

Manufacturer Part Number
D12312SVTEBL25
Description
IC H8S MCU ROMLESS 100-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheets

Specifications of D12312SVTEBL25

Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
POR, PWM, WDT
Number Of I /o
70
Program Memory Type
ROMless
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-
Other names
HD6412312SVTEBL25
HD6412312SVTEBL25
Section 17 ROM
Table 17.70 AC Characteristics Status Read Mode
Condition: V
Code
Command write cycle
CE hold time
CE setup time
Data hold time
Data setup time
Programming pulse width
OE output delay time
Disable delay time
CE output delay time
WE rise time
WE fall time
Table 17.71 Stipulated Transition Times to Command Wait State
Code
Standby release (oscillation settling
time)
PROM mode setup time
V
Rev.7.00 Feb. 14, 2007 page 786 of 1108
REJ09B0089-0700
CC
hold time
I/O7-0
A18-0
Note: I/O
WE
OE
CE
CC
3
and I/O
= 3.3 V ± 0.3 V, V
t
ces
tf
2
are undefined.
t
ds
t
wep
Figure 17.94 Timing in Status Read Mode
H'71
t
tr
ceh
t
dh
SS
t
nxtc
= 0 V, T
t
t
t
t
t
t
t
t
t
t
t
t
t
Symbol
t
Symbol
nxtc
ceh
ces
dh
ds
wep
oe
df
ce
r
f
t
osc1
bmv
dwn
ces
tf
t
ds
t
a
wep
= 25˚C ± 5˚C
H'71
t
tr
ceh
t
dh
Min
20
0
0
50
50
70
Min
30
10
0
t
nxtc
t
ce
t
oe
Max
150
100
150
30
30
Max
t
df
t
nxtc
Unit
μs
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Unit
ms
ms
ms

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