D12312SVTEBL25 Renesas Electronics America, D12312SVTEBL25 Datasheet - Page 722

• Manufacturer Part Number: D12312SVTEBL25
• Description: IC H8S MCU ROMLESS 100-QFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2300r

Specifications of D12312SVTEBL25

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: POR, PWM, WDT
• Number Of I /o: 70
• Program Memory Type: ROMless
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Program Memory Size: -
• Other names: HD6412312SVTEBL25; HD6412312SVTEBL25

Section 17 ROM
17.22.2 Overview
(1) Block Diagram
Rev.7.00 Feb. 14, 2007 page 688 of 1108
REJ09B0089-0700
Note: To read from or write to any of the registers above except RAMER, the FLSHE bit
Mode pin
in system control register 2 (SYSCR2) must be set to 1.
Legend:
FCCS:
FPCS:
FECS:
FKEY:
FMATS: Flash MAT select register
FTDAR: Flash transfer destination address register
RAMER: RAM emulation register
Flash code control and status register
Flash program code select register
Flash erase code select register
Flash key code register
FMATS
FTDAR
RAMER
Figure 17.60 Block Diagram of Flash Memory
FCCS
FPCS
FECS
FKEY
Operating
mode
Internal data bus (16 bits)
Control unit
Internal address bus
Flash memory
User MAT: 512 kbytes
User boot MAT: 8 kbytes
Memory MAT unit