D12312SVTEBL25 Renesas Electronics America, D12312SVTEBL25 Datasheet - Page 607

IC H8S MCU ROMLESS 100-QFP

D12312SVTEBL25

Manufacturer Part Number
D12312SVTEBL25
Description
IC H8S MCU ROMLESS 100-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheets

Specifications of D12312SVTEBL25

Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
POR, PWM, WDT
Number Of I /o
70
Program Memory Type
ROMless
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-
Other names
HD6412312SVTEBL25
HD6412312SVTEBL25
17.4.3
Mode Transitions: When the mode pins and the FWE pin are set in the reset state and a reset-
start is executed, the chip enters one of the operating modes shown in figure 17.3. In user mode,
flash memory can be read but not programmed or erased.
Flash memory can be programmed and erased in boot mode, user program mode, and programmer
mode.
Notes: Only make a transition between user mode and user program mode when the CPU is
FWE = 1,
SWE = 1
(on-chip ROM
User mode
enabled)
Flash Memory Operating Modes
not accessing the flash memory.
* MD2 = MD1 = MD0 = 0, PF2 = 1, PF1 = PF0 = 0
On-board programming mode
program mode
FWE = 0
or SWE = 0
User
Figure 17.3 Flash Memory Mode Transitions
MD1 = 1,
MD2 = 1,
FWE = 0
RES = 0
RES = 0
FWE = 1,
MD1 = 1,
MD2 = 0
Reset state
Boot mode
Rev.7.00 Feb. 14, 2007 page 573 of 1108
RES = 0
*
RES = 0
Programmer mode
REJ09B0089-0700
Section 17 ROM

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