D12312SVTEBL25 Renesas Electronics America, D12312SVTEBL25 Datasheet - Page 599

• Manufacturer Part Number: D12312SVTEBL25
• Description: IC H8S MCU ROMLESS 100-QFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2300r

Specifications of D12312SVTEBL25

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: POR, PWM, WDT
• Number Of I /o: 70
• Program Memory Type: ROMless
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Program Memory Size: -
• Other names: HD6412312SVTEBL25; HD6412312SVTEBL25

17.1
This LSI has 512, 384, 256, or 128 kbytes of on-chip flash memory, or 512, 384, 256, 128, or 64
kbytes of on-chip mask ROM. The ROM is connected to the bus master via a 16-bit data bus,
enabling both byte and word data to be accessed in one state. Instruction fetching is thus speeded
up, and processing speed increased.
The on-chip ROM is enabled and disabled by means of the mode pins (MD2 to MD0) and the
EAE bit in BCRL.
The flash memory version of the chip can be erased and programmed with a PROM programmer,
as well as on-board.
17.1.1
Figure 17.1 shows a block diagram of 512 kbytes of on-chip ROM.
Overview
Block Diagram
Figure 17.1 Block Diagram of ROM (512 kbytes)
H'07FFFE
H'000000
H'000002
Section 17 ROM
Internal data bus (upper 8 bits)
Internal data bus (lower 8 bits)
Rev.7.00 Feb. 14, 2007 page 565 of 1108
H'07FFFF
H'000001
H'000003
REJ09B0089-0700
Section 17 ROM