D12312SVTEBL25 Renesas Electronics America, D12312SVTEBL25 Datasheet - Page 188

• Manufacturer Part Number: D12312SVTEBL25
• Description: IC H8S MCU ROMLESS 100-QFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2300r

Specifications of D12312SVTEBL25

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: POR, PWM, WDT
• Number Of I /o: 70
• Program Memory Type: ROMless
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Program Memory Size: -
• Other names: HD6412312SVTEBL25; HD6412312SVTEBL25

Section 6 Bus Controller
Table 6.3
ABWCR
ABWn
0
1
6.3.3
The chip’s memory interfaces comprise a basic bus interface that allows direct connection of
ROM, SRAM, and so on; and a burst ROM interface that allows direct connection of burst ROM.
The interface can be selected independently for each area.
An area for which the basic bus interface is designated functions as normal space, and an area for
which the burst ROM interface is designated functions as burst ROM space.
Rev.7.00 Feb. 14, 2007 page 154 of 1108
REJ09B0089-0700
Memory Interfaces
ASTCR
ASTn
0
1
0
1
Bus Specifications for Each Area (Basic Bus Interface)
Wn1
—
0
1
—
0
1
WCRH, WCRL
Wn0
—
0
1
0
1
—
0
1
0
1
Bus Width
16
8
Bus Specifications (Basic Bus Interface)
Access States
2
3
2
3
Program Wait
States
0
0
1
2
3
0
0
1
2
3