MC9S12XA256CAL Freescale Semiconductor, MC9S12XA256CAL Datasheet - Page 1291

• Manufacturer Part Number: MC9S12XA256CAL
• Description: IC MCU 256K FLASH 112-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of MC9S12XA256CAL

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 80MHz
• Connectivity: EBI/EMI, I²C, IrDA, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 91
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 4K x 8
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 2.35 V ~ 5.5 V
• Data Converters: A/D 16x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 112-LQFP
• No. Of I/o's: 91
• Eeprom Memory Size: 4KB
• Ram Memory Size: 16KB
• Cpu Speed: 80MHz
• No. Of Timers: 1
• No. Of Pwm Channels: 8
• Digital Ic Case Style: LQFP
• Rohs Compliant: Yes
• Processor Series: S12XA
• Core: HCS12
• Data Bus Width: 16 bit
• Data Ram Size: 16 KB
• Interface Type: CAN, I2C, SCI, SPI
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 91
• Number Of Timers: 12
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWHCS12
• Development Tools By Supplier: EVB9S12XDP512E
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 2 (10 bit, 16 Channel)
• Package: 112LQFP
• Family Name: HCS12
• Maximum Speed: 40 MHz
• Operating Supply Voltage: 2.5|5 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

B.3
Freescale Semiconductor
SEATING
PLANE
DATUM
PLANE
-C-
L
C
-A-
-H-
80-Pin QFP Package
E
H
61
80
60
DETAIL C
1
Figure B-3. 80-Pin QFP Mechanical Dimensions (Case No. 841B)
G
0.20
0.05 A-B
0.20
W
M
M
X
H
C
S
K
A
L
A-B
A-B
DETAIL A
U
MC9S12XDP512 Data Sheet, Rev. 2.21
R
-D-
T
S
S
D
D
Q
S
S
M
M
20
NOTES:
41
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE -H- IS LOCATED AT BOTTOM OF
4. DATUMS -A-, -B- AND -D- TO BE
5. DIMENSIONS S AND V TO BE DETERMINED
6. DIMENSIONS A AND B DO NOT INCLUDE
7. DIMENSION D DOES NOT INCLUDE DAMBAR
ANSI Y14.5M, 1982.
LEAD AND IS COINCIDENT WITH THE
LEAD WHERE THE LEAD EXITS THE PLASTIC
BODY AT THE BOTTOM OF THE PARTING LINE.
DETERMINED AT DATUM PLANE -H-.
AT SEATING PLANE -C-.
MOLD PROTRUSION. ALLOWABLE
PROTRUSION IS 0.25 PER SIDE. DIMENSIONS
A AND B DO INCLUDE MOLD MISMATCH
AND ARE DETERMINED AT DATUM PLANE -H-.
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.08 TOTAL IN
EXCESS OF THE D DIMENSION AT MAXIMUM
MATERIAL CONDITION. DAMBAR CANNOT
BE LOCATED ON THE LOWER RADIUS OR
THE FOOT.
40
21
-B-
B
DETAIL C
-H-
0.10
DATUM
PLANE
V
Appendix B Package Information
J
0.20
SECTION B-B
VIEW ROTATED 90
DETAIL A
B
B
M
C
DIM
M
W
F
D
A
B
C
D
E
F
G
H
K
L
N
P
Q
R
S
T
U
V
X
J
A-B
13.90
13.90
16.95
16.95
MILLIMETERS
MIN
2.15
0.22
2.00
0.22
0.13
0.65
0.13
0.13
0.13
0.35
12.35 REF
0.325 BSC
0.65 BSC
5
0
0
---
1.6 REF
S
-A-,-B-,-D-
N
14.10
14.10
17.45
17.45
MAX
D
2.45
0.38
2.40
0.33
0.25
0.23
0.95
0.17
0.30
0.45
P
10
7
---
---
S
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