MC9S12XA256CAL Freescale Semiconductor, MC9S12XA256CAL Datasheet - Page 1290

IC MCU 256K FLASH 112-LQFP

MC9S12XA256CAL

Manufacturer Part Number
MC9S12XA256CAL
Description
IC MCU 256K FLASH 112-LQFP
Manufacturer
Freescale Semiconductor
Series
HCS12r
Datasheets

Specifications of MC9S12XA256CAL

Core Processor
HCS12X
Core Size
16-Bit
Speed
80MHz
Connectivity
EBI/EMI, I²C, IrDA, LIN, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
91
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Eeprom Size
4K x 8
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
2.35 V ~ 5.5 V
Data Converters
A/D 16x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
112-LQFP
No. Of I/o's
91
Eeprom Memory Size
4KB
Ram Memory Size
16KB
Cpu Speed
80MHz
No. Of Timers
1
No. Of Pwm Channels
8
Digital Ic Case Style
LQFP
Rohs Compliant
Yes
Processor Series
S12XA
Core
HCS12
Data Bus Width
16 bit
Data Ram Size
16 KB
Interface Type
CAN, I2C, SCI, SPI
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
91
Number Of Timers
12
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWHCS12
Development Tools By Supplier
EVB9S12XDP512E
Minimum Operating Temperature
- 40 C
On-chip Adc
2 (10 bit, 16 Channel)
Package
112LQFP
Family Name
HCS12
Maximum Speed
40 MHz
Operating Supply Voltage
2.5|5 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC9S12XA256CAL
Manufacturer:
AD
Quantity:
101
Part Number:
MC9S12XA256CAL
Manufacturer:
FREESCALE
Quantity:
7 765
Part Number:
MC9S12XA256CAL
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MC9S12XA256CAL
Manufacturer:
FREESCALE
Quantity:
7 765
Part Number:
MC9S12XA256CAL
Manufacturer:
FREESCALE
Quantity:
20 000
Appendix B Package Information
B.2
1292
PIN 1
IDENT
C
L
C1
112-Pin LQFP Package
28
1
4X
C2
112
29
VIEW Y
0.050
VIEW AB
0.20
S1
A1
Figure B-2. 112-Pin LQFP Mechanical Dimensions (Case No. 987)
T
L-M
N
A
S
N
(Y)
(Z)
(K)
E
MC9S12XDP512 Data Sheet, Rev. 2.21
R
4X 28 TIPS
3
2
R2
R
R1
85
56
1
84
57
M
0.20
B1
GAGE PLANE
0.25
VIEW AB
T
T
V1
L-M
0.10
B
SEATING
PLANE
N
T
V
112X
C L
ROTATED 90 COUNTERCLOCKWISE
J1
J1
NOTES:
J
1. DIMENSIONING AND TOLERANCING PER
2. DIMENSIONS IN MILLIMETERS.
3. DATUMS L, M AND N TO BE DETERMINED AT
4. DIMENSIONS S AND V TO BE DETERMINED AT
5. DIMENSIONS A AND B DO NOT INCLUDE
6. DIMENSION D DOES NOT INCLUDE DAMBAR
ASME Y14.5M, 1994.
SEATING PLANE, DATUM T.
SEATING PLANE, DATUM T.
MOLD PROTRUSION. ALLOWABLE
PROTRUSION IS 0.25 PER SIDE. DIMENSIONS
A AND B INCLUDE MOLD MISMATCH.
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL NOT CAUSE THE D
DIMENSION TO EXCEED 0.46.
SECTION J1-J1
0.13
DIM
AA
A1
B1
C1
C2
R1
R2
S1
V1
A
B
C
D
E
G
K
P
S
V
Y
F
J
Z
1
2
3
108X
VIEW Y
0.050
1.350
0.270
0.450
0.270
0.090
0.100
0.100
0.090
MILLIMETERS
M
MIN
11
11
20.000 BSC
10.000 BSC
20.000 BSC
10.000 BSC
22.000 BSC
11.000 BSC
22.000 BSC
11.000 BSC
3
0.650 BSC
0.500 REF
0.325 BSC
0.250 REF
1.000 REF
0
---
D
F
G
T
1.600
0.150
1.450
0.370
0.750
0.330
0.170
0.200
0.200
0.160
4X
MAX
13
Freescale Semiconductor
13
L-M
8
7
P
X=L, M OR N
X
N
AA
BASE
METAL

Related parts for MC9S12XA256CAL