MC9S08EL16CTJ Freescale Semiconductor, MC9S08EL16CTJ Datasheet - Page 354
![MCU 16KB FLASH SLIC 20TSSOP](/photos/12/26/122655/mc9s08el16ctj_sml.jpg)
MC9S08EL16CTJ
Manufacturer Part Number
MC9S08EL16CTJ
Description
MCU 16KB FLASH SLIC 20TSSOP
Manufacturer
Freescale Semiconductor
Series
HCS08r
Datasheet
1.DEMO9S08EL32.pdf
(356 pages)
Specifications of MC9S08EL16CTJ
Core Processor
HCS08
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, LIN, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
16
Program Memory Size
16KB (16K x 8)
Program Memory Type
FLASH
Eeprom Size
512 x 8
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 12x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
20-TSSOP
Processor Series
S08EL
Core
HCS08
Data Bus Width
8 bit
Data Ram Size
1 KB
Interface Type
SCI, SPI, I2C, SLIC
Maximum Clock Frequency
200 KHz
Number Of Programmable I/os
16
Number Of Timers
2
Operating Supply Voltage
5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWS08
Development Tools By Supplier
DEMO9S08EL32AUTO, DEMO9S08EL32
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 12 Channel
For Use With
DEMO9S08EL32 - BOARD DEMO FOR 9S08 EL MCUDEMO9S08EL32AUTO - DEMO BOARD EL32 AUTO
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
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Appendix B Ordering Information and Mechanical Drawings
B.2
The latest package outline drawings are available on the product summary pages on
http://www.freescale.com.
the web page’s keyword search engine to find the latest package outline drawings.
356
Mechanical Drawings
Pin Count
28
20
Thin shrink small outline package
Thin shrink small outline package
MC9S08EL32 Series and MC9S08SL16 Series Data Sheet, Rev. 3
Table B-2
Type
Table B-2. Package Descriptions
lists the document numbers per package type. Use these numbers in
Abbreviation
TSSOP
TSSOP
Designator
TL
TJ
98ARS23923W
Document No.
98ASH70169A
Freescale Semiconductor
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