MC9S08EL16CTJ Freescale Semiconductor, MC9S08EL16CTJ Datasheet - Page 17
MC9S08EL16CTJ
Manufacturer Part Number
MC9S08EL16CTJ
Description
MCU 16KB FLASH SLIC 20TSSOP
Manufacturer
Freescale Semiconductor
Series
HCS08r
Datasheet
1.DEMO9S08EL32.pdf
(356 pages)
Specifications of MC9S08EL16CTJ
Core Processor
HCS08
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, LIN, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
16
Program Memory Size
16KB (16K x 8)
Program Memory Type
FLASH
Eeprom Size
512 x 8
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 12x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
20-TSSOP
Processor Series
S08EL
Core
HCS08
Data Bus Width
8 bit
Data Ram Size
1 KB
Interface Type
SCI, SPI, I2C, SLIC
Maximum Clock Frequency
200 KHz
Number Of Programmable I/os
16
Number Of Timers
2
Operating Supply Voltage
5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWS08
Development Tools By Supplier
DEMO9S08EL32AUTO, DEMO9S08EL32
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 12 Channel
For Use With
DEMO9S08EL32 - BOARD DEMO FOR 9S08 EL MCUDEMO9S08EL32AUTO - DEMO BOARD EL32 AUTO
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
- Current page: 17 of 356
- Download datasheet (9Mb)
Section Number
16.6 Interrupts .......................................................................................................................................300
16.7 The Differences from TPM v2 to TPM v3 ....................................................................................302
17.1 Introduction ...................................................................................................................................307
17.2 Background Debug Controller (BDC) ..........................................................................................310
17.3 On-Chip Debug System (DBG) ....................................................................................................319
17.4 Register Definition ........................................................................................................................323
A.1 Introduction ...................................................................................................................................331
A.2 Parameter Classification ................................................................................................................331
A.3 Absolute Maximum Ratings ..........................................................................................................331
A.4 Thermal Characteristics .................................................................................................................332
A.5 ESD Protection and Latch-Up Immunity ......................................................................................333
A.6 DC Characteristics .........................................................................................................................334
A.7 Supply Current Characteristics ......................................................................................................338
A.8 External Oscillator (XOSC) Characteristics .................................................................................341
A.9 Internal Clock Source (ICS) Characteristics .................................................................................342
A.10 Analog Comparator (ACMP) Electricals ......................................................................................343
A.11 ADC Characteristics ......................................................................................................................344
A.12 AC Characteristics .........................................................................................................................347
Freescale Semiconductor
16.6.1 General ............................................................................................................................300
16.6.2 Description of Interrupt Operation .................................................................................301
17.1.1 Forcing Active Background ............................................................................................307
17.1.2 Features ...........................................................................................................................310
17.2.1 BKGD Pin Description ...................................................................................................311
17.2.2 Communication Details ..................................................................................................312
17.2.3 BDC Commands .............................................................................................................316
17.2.4 BDC Hardware Breakpoint .............................................................................................318
17.3.1 Comparators A and B .....................................................................................................319
17.3.2 Bus Capture Information and FIFO Operation ...............................................................319
17.3.3 Change-of-Flow Information ..........................................................................................320
17.3.4 Tag vs. Force Breakpoints and Triggers .........................................................................320
17.3.5 Trigger Modes .................................................................................................................321
17.3.6 Hardware Breakpoints ....................................................................................................323
17.4.1 BDC Registers and Control Bits .....................................................................................323
17.4.2 System Background Debug Force Reset Register (SBDFR) ..........................................325
17.4.3 DBG Registers and Control Bits .....................................................................................326
A.12.1 Control Timing ...............................................................................................................347
MC9S08EL32 Series and MC9S08SL16 Series Data Sheet, Rev. 3
Electrical Characteristics
Development Support
Appendix A
Chapter 17
Title
Page
17
Related parts for MC9S08EL16CTJ
Image
Part Number
Description
Manufacturer
Datasheet
Request
R
Part Number:
Description:
Manufacturer:
Freescale Semiconductor, Inc
Datasheet:
Part Number:
Description:
Manufacturer:
Freescale Semiconductor, Inc
Datasheet:
Part Number:
Description:
Manufacturer:
Freescale Semiconductor, Inc
Datasheet:
Part Number:
Description:
Manufacturer:
Freescale Semiconductor, Inc
Datasheet:
Part Number:
Description:
Manufacturer:
Freescale Semiconductor, Inc
Datasheet:
Part Number:
Description:
Manufacturer:
Freescale Semiconductor, Inc
Datasheet:
Part Number:
Description:
Manufacturer:
Freescale Semiconductor, Inc
Datasheet:
Part Number:
Description:
Manufacturer:
Freescale Semiconductor, Inc
Datasheet:
Part Number:
Description:
Manufacturer:
Freescale Semiconductor, Inc
Datasheet:
Part Number:
Description:
Manufacturer:
Freescale Semiconductor, Inc
Datasheet:
Part Number:
Description:
Manufacturer:
Freescale Semiconductor, Inc
Datasheet:
Part Number:
Description:
Manufacturer:
Freescale Semiconductor, Inc
Datasheet:
Part Number:
Description:
Manufacturer:
Freescale Semiconductor, Inc
Datasheet:
Part Number:
Description:
Manufacturer:
Freescale Semiconductor, Inc
Datasheet:
Part Number:
Description:
Manufacturer:
Freescale Semiconductor, Inc
Datasheet: