MCF5272CVF66 Freescale Semiconductor, MCF5272CVF66 Datasheet - Page 192

• Manufacturer Part Number: MCF5272CVF66
• Description: IC MPU 32BIT 66MHZ 196-MAPBGA
• Manufacturer: Freescale Semiconductor
• Series: MCF527xr

Specifications of MCF5272CVF66

• Core Processor: Coldfire V2
• Core Size: 32-Bit
• Speed: 66MHz
• Connectivity: EBI/EMI, Ethernet, I²C, SPI, UART/USART, USB
• Peripherals: DMA, WDT
• Number Of I /o: 32
• Program Memory Size: 16KB (4K x 32)
• Program Memory Type: ROM
• Ram Size: 1K x 32
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 196-MAPBGA
• Family Name: MCF5xxx
• Device Core: ColdFire
• Device Core Size: 32b
• Frequency (max): 66MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 3.3V
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 196
• Package Type: MA-BGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Not Compliant

SDRAM Controller
Table 9-1
9-2
A10_PRECHG
Internal 32-Bit Address Bus
DRESETEN
SDA[13:0]/
SDBA[1:0]
BS[3:0]
A[22:0]
Signal
CAS0
RAS0
describes SDRAM controller signals.
A10 precharge strobe. A precharge cycle occurs only after a page miss. During precharge, the SDRAM
writes the designated on-chip RAM page buffer back into the SDRAM array. Precharge latency is set
in SDTR[RP]. The reset value is 2 cycles, RP = 01.
For SDRAM devices, these outputs should be connected to individual DQM signals. During SDRAM
accesses, these signals indicate a byte transfer between SDRAM and the MCF5272 when asserted.
Note that most SDRAMs associate DQM3 with the MSB, in which case BS3 should be connected to
the SDRAM's DQM3 input, and so forth.
SDRAM column address strobe output
DRESETEN is asserted to indicate that the SDRAM controller is to be reset whenever RSTI asserts. If
DRESETEN is negated, RSTI does not affect the SDRAM controller, which continues to refresh
external memory. This is useful for debug situations where a reset of the device is required without
losing data located in SDRAM. DRESETEN is normally tied high or low depending on system
requirements. It should never be tied to RSTI or RSTO.
SDRAM row address strobe output
Fourteen address signals are multiplexed to form SDRAM_ADR[13:0], which are used for connecting
to SDRAM devices as large as 256 Mbits. SDRAM can be configured for 16- or 32-bit wide interface to
the MCF5272 data bus. For an SDRAM array with a 32-bit data bus, SDRAM address signals are
multiplexed starting with A2. For a 16-bit data bus, address signals are multiplexed starting with A1.
SDRAM controller bank address select outputs. Assigned to internal high-order address signals by
programming SDCR[BALOC]. This allows using SDRAM devices of different sizes without changing
the board layout. See
MCF5272 ColdFire
Table 9-1. SDRAM Controller Signal Descriptions
Figure 9-1. SDRAM Controller Signals
®
Address Multiplexer
Table
Dynamic Bus Sizer
SDRAM Controller
Integrated Microprocessor User’s Manual, Rev. 3
9-7.
10
32
1
1
1
1
4
2
1
1
1
8
2
Description
D[31:0]
SDRAMCS/CS7
RAS0
CAS0
SDWE
BS[3:0]
SDBA[1:0]
SDCLKE
SDCLK
A10_PRECHG
A[22:15]
A[11:2]/SDA[9:0]
A[14:13/SDA[12:11]
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