MCIMX255AJM4AR2 Freescale Semiconductor, MCIMX255AJM4AR2 Datasheet - Page 20

• Manufacturer Part Number: MCIMX255AJM4AR2
• Description: Processors - Application Specialized IMX25 1.2 AUTO
• Manufacturer: Freescale Semiconductor

Specifications of MCIMX255AJM4AR2

• Core: ARM926EJ-S
• Processor Series: MCIMX25
• Maximum Clock Frequency: 400 MHz
• Instruction / Data Cache Memory: 16 KB
• Data Ram Size: 128 KB
• Operating Supply Voltage: 1.15 V to 1.52 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Package / Case: MAPBGA-400
• Interface Type: USB
• Memory Type: DDR2
• Minimum Operating Temperature: - 40 C

3.5
This section includes the DC parameters of the following I/O types:
3.5.1
The DDR pad type is configured by the IOMUXC_SW_PAD_CTL_GRP_DDRTYPE register (see the
External Signals and Pin Multiplexing chapter of the i.MX25 Reference Manual for details).
20
1
2
3
4
Junction to ambient
Junction to ambient
Junction to ambient
Junction to ambient
Junction to boards
Junction to case (top)
Junction to package top
Junction-to-ambient thermal resistance determined per JEDC JESD51-3 and JESD51-6. Thermal test board meets JEDEC
specification for this package.
Junction-to-board thermal resistance determined per JEDC JESD51-8. Thermal test board meets JEDEC specification for
this package.
Junction-to-case at the top of the package determined using MIL-STD 883 Method 1012.1. The cold plate temperature is
used for the case temperature. Reported value includes the thermal resistance of the interface layer.
Thermal characterization parameter indicating the temperature difference between the package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, this thermal characterization parameter is written
as Psi-JT.
•
•
DDR I/O: Mobile DDR (mDDR), double data rate (DDR2), or synchronous dynamic random
access memory (SDRAM)
General purpose I/O (GPIO)
I/O DC Parameters
DDR I/O DC Parameters
The term ‘OVDD’ in this section refers to the associated supply rail of an
input or output. The association is shown in the “Signal Multiplexing”
chapter of the reference manual.
2
1
1
1
1
natural convection
natural convection
(@200 ft/min)
(@200 ft/min)
3
Rating
4
i.MX25 Applications Processor for Automotive Products, Rev. 9
Table 16. Thermal Resistance Data
Single layer board (1s)
Four layer board (2s2p)
Single layer board (1s)
Four layer board (2s2p)
Natural convection
NOTE
Condition
—
—
Symbol
R
R
R
R
R
R
eJCtop
eJMA
eJMA
eJA
eJA
eJB
JT
Freescale Semiconductor
Value
55
33
46
29
22
13
2
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit