MCIMX255AJM4AR2 Freescale Semiconductor, MCIMX255AJM4AR2 Datasheet - Page 19

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MCIMX255AJM4AR2

Manufacturer Part Number
MCIMX255AJM4AR2
Description
Processors - Application Specialized IMX25 1.2 AUTO
Manufacturer
Freescale Semiconductor
Datasheet

Specifications of MCIMX255AJM4AR2

Core
ARM926EJ-S
Processor Series
MCIMX25
Maximum Clock Frequency
400 MHz
Instruction / Data Cache Memory
16 KB
Data Ram Size
128 KB
Operating Supply Voltage
1.15 V to 1.52 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Package / Case
MAPBGA-400
Interface Type
USB
Memory Type
DDR2
Minimum Operating Temperature
- 40 C
The method for obtaining the maximum current is as follows:
3.4
The thermal resistance characteristics for the device are given in
under the following conditions:
Freescale Semiconductor
1
FUSE_VDD
BATT_VDD
The FUSE_VDD rail is connected to ground. it only needs a voltage if the system fuse burning is needed.
1. Measure the worst case power consumption on individual rails using directed test on i.MX25.
2. Correlate the worst case power consumption power measurements with the worst case power
3. Combine common voltage rails based on the power supply sequencing requirements (add the
4. Guard the worst case numbers for temperature and process variation.
5. The sum of individual rails is greater than the real world power consumption, since a real system
6. BATT_VDD current is measured when the system is in reduced power mode maintaining the
consumption simulations.
worst case power consumption on each rail within some test cases from several test cases run, to
maximize different rails in the power group).
does not typically maximize the power consumption on all peripherals simultaneously.
RTC. When the system is in run mode, QVDD is used to supply the DryIce, so this current
becomes negligible. See
Two-layer substrate
Substrate solder mask thickness: 0.025 mm
Substrate metal thicknesses: 0.016 mm
Substrate core thickness: 0.200 mm
Core through I.D: 0.118 mm, Core through plating 0.016 mm.
Flag: Trace style with ground balls under the die connected to the flag
Die Attach: 0.033 mm non-conductive die attach, k = 0.3 W/m K
Mold compound: Generic mold compound; k = 0.9 W/m K
Thermal Characteristics
1
The values mentioned above should not be taken as a typical max run data
for specific use cases. These values are Absolute MAX data. Freescale
recommends that the system current measurements are taken with
customer-specific use-cases to reflect normal operating conditions in the
end system.
Power Supply
i.MX25 Applications Processor for Automotive Products, Rev. 9
Table 15. Power Consumption (continued)
Table
12, for more details on the power modes.
NOTE
Voltage (V)
1.55
3.6
Table
16. These values are measured
Max Current (mA)
0.030
62
19

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