MCIMX255AJM4AR2 Freescale Semiconductor, MCIMX255AJM4AR2 Datasheet - Page 138

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MCIMX255AJM4AR2

Manufacturer Part Number
MCIMX255AJM4AR2
Description
Processors - Application Specialized IMX25 1.2 AUTO
Manufacturer
Freescale Semiconductor
Datasheet

Specifications of MCIMX255AJM4AR2

Core
ARM926EJ-S
Processor Series
MCIMX25
Maximum Clock Frequency
400 MHz
Instruction / Data Cache Memory
16 KB
Data Ram Size
128 KB
Operating Supply Voltage
1.15 V to 1.52 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Package / Case
MAPBGA-400
Interface Type
USB
Memory Type
DDR2
Minimum Operating Temperature
- 40 C
5
Table 104
138
Number
Rev. 9
Rev. 8
Rev. 7
Rev. 6
Rev. 5
Rev. 4
Rev. 3
Rev.
Revision History
06/2012 • In
01/2011 • Updated the first paragraph of
09/2010 • Added
08/2010 • Updated
06/2010 • Updated
summarizes revisions to this document.
Date
This revision number was skipped so the Consumer/Industrial and Automotive revision numbers can be in
sync.
This revision number was skipped so the Consumer/Industrial and Automotive revision numbers can be in
sync.
• In
• In
• Updated
• Updated
• In
• In
• Updated the note after
• In
• Updated
• Updated the third note for
• Added
• Added
• In
• In
• Added a note for the line NVCC_DRYICE in
• Updated
• Updated
removed table footnote.
SIM.
—Removed “_B” and added an overbar to signal names, CSx_B, RW_B, OE_B, EBy_B, LBA_B,
ECB_B, and DTACK_B
—Changed CSx and CSy to CS[x] and CS[y], respectively
—Changed WE and WEA to RW and RWA, respectively, for reference number, WE33
—Changed WE and WEN to RW and RWN, respectively, for reference number, WE34
—Changed RLBA, RLBN, and ADH to LBA, LBN, and LAH, respectively, for reference number, WE35A
—Changed RBEA to EBRA for reference number, WE37
—Changed RBEN to EBRN for reference number, WE38
—Changed WCSA to CSA for reference numbers, WE41 and WE41A
—Changed WLBA, WLBN, and ADH to LBA, LBN, and LAH, respectively, for reference number, WE41A
—Changed WBEA and WBEN to EBWA and EBWN, respectively, for reference numbers, WE45 and
WE46
Max columns for IDs, US15 and US16.
to 133 MHz.
specification has been updated to 133 MHz.
Reference Contact Assignments," on page
Table 27, "AC Parameters for SDRAM I/O," on page
Section 1, “Introduction,”
Table 1, "Ordering Information," on page
Table 3, "i.MX25 Digital and Analog Modules," on page
Figure 38
Table 57, "WEIM Asynchronous Timing Parameters Relative to Chip Select Table," on page
Table 99, "USB Timing Specification in Parallel Mode," on page
Table 28, "AC Parameters for SDRAM pbijtov18_33_ddr_clk I/O," on page
i.MX25 Applications Processor for Automotive Products, Rev. 9
Table 9, "Recommended External Crystal Specifications," on page
Table 10, "Recommended External Reference Clock Specifications," on page
Section 3.2.3, “SRTC DryIce Power-Up/Down Sequence.”
Table 6, "DC Operating Conditions," on page 11
Section 3.2.1, “Power-Up Sequence.”
Section 3.2.3, “SRTC DryIce Power-Up/Down Sequence.”
Table 4, "Signal Considerations," on page 9
Table 101, "17×17 mm Package i.MX25 Signal Contact Assignment," on page
Table 56, "WEIM Bus Timing Parameters," on page 69
Table
and
1,
Table
“Ordering Information,”
Table 104. Revision History
56:
Table
Table 6, "DC Operating Conditions," on page 11.
modified the first paragraph.
57.
Section 3.2.3, “SRTC DryIce Power-Up/Down Sequence.”
Substantive Change(s)
to include new part numbers.
Table 100, "17 17 mm Package Ground, Power Sense, and
125.
3, removed exclamation marks from table rows and also
for NVCC_DRYICE signal.
36, the frequency specification has been updated
to include Min and Max values of FUSE_VDD.
6, modified description of block mnemonic,
to include new row for WE19.
124, swapped the values of Min and
13.
37, the frequency
Freescale Semiconductor
13.
127.
76:

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