MT47H32M16HR-25E AIT:G Micron, MT47H32M16HR-25E AIT:G Datasheet - Page 21
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MT47H32M16HR-25E AIT:G
Manufacturer Part Number
MT47H32M16HR-25E AIT:G
Description
DRAM Chip DDR2 SDRAM 512M-Bit 32Mx16 1.8V 84-Pin FBGA
Manufacturer
Micron
Datasheet
1.MT47H64M8CF-25E_ITG.pdf
(129 pages)
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Table 6: Temperature Limits
Figure 9: Example Temperature Test Point Location
PDF: 09005aef8440dbbc
512mbddr2_ait_aat.pdf – Rev. C 7/11 EN
Parameter
Storage temperature
Operating temperature: commercial
Operating temperature: industrial
Operating temperature: automotive
Notes:
Test point
1. MAX storage case temperature T
2. MAX operating case temperature T
3. Device functionality is not guaranteed if the device exceeds maximum T
4. Both temperature specifications must be satisfied.
5. Operating ambient temperature surrounding the package.
in Figure 9. This case temperature limit is allowed to be exceeded briefly during package
reflow, as noted in Micron technical note TN-00-15, “Recommended Soldering Parame-
ters.”
in Figure 9.
operation.
Lmm x Wmm FBGA
Micron Confidential and Proprietary
Width (W)
0.5 (W)
Electrical Specifications – Absolute Ratings
Symbol
0.5 (L)
21
512Mb: x8, x16 Automotive DDR2 SDRAM
T
T
T
T
T
T
Length (L)
STG
A
A
C
C
C
STG
C
is measured in the center of the package, as shown
Micron Technology, Inc. reserves the right to change products or specifications without notice.
is measured in the center of the package, as shown
Min
–55
–40
–40
–40
–40
0
Max
150
105
105
85
95
85
2010 Micron Technology, Inc. All rights reserved.
Units
°C
°C
°C
°C
°C
°C
C
during
Notes
2, 3 , 4
2, 3, 4
2, 3
4, 5
4, 5
1
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