MT47H32M16HR-25E AIT:G Micron, MT47H32M16HR-25E AIT:G Datasheet - Page 17

• Manufacturer Part Number: MT47H32M16HR-25E AIT:G
• Description: DRAM Chip DDR2 SDRAM 512M-Bit 32Mx16 1.8V 84-Pin FBGA
• Manufacturer: Micron

Packaging
Package Dimensions
Figure 7: 84-Ball FBGA (8mm x 12.5mm) – x16
PDF: 09005aef8440dbbc
512mbddr2_ait_aat.pdf – Rev. C 7/11 EN
Solder ball material:
SAC305
3% Ag, 0.5% Cu)
Dimensions apply to
solder balls post-reflow
on Ø0.35 SMD
ball pads.
Seating
84X Ø0.45
plane
0.12 A
(96.5% Sn,
11.2 CTR
0.8 TYP
.
Notes:
A
Nonconductive overmold
9 8
1. All dimensions are in millimeters.
2. Solder ball material for this package is also available as leaded eutectic (62% Sn, 36%
Pb, 2% Ag).
7
1.8 CTR
6.4 CTR
TYP
8 ±0.1
0.8
Micron Confidential and Proprietary
3 2
1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
17
Ball A1 ID
512Mb: x8, x16 Automotive DDR2 SDRAM
12.5 ±0.1
0.8 ±0.05
0.155
Micron Technology, Inc. reserves the right to change products or specifications without notice.
0.25 MIN
1.2 MAX
‹ 2010 Micron Technology, Inc. All rights reserved.
Ball A1 ID
Packaging