MC9S08GT16CFB Freescale Semiconductor, MC9S08GT16CFB Datasheet - Page 33

• Manufacturer Part Number: MC9S08GT16CFB
• Manufacturer: Freescale Semiconductor

Specifications of MC9S08GT16CFB

• Cpu Family: HCS08
• Device Core Size: 8b
• Frequency (max): 20MHz
• Interface Type: SCI/SPI
• Program Memory Type: Flash
• Program Memory Size: 16KB
• Total Internal Ram Size: 1KB
• # I/os (max): 36
• Number Of Timers - General Purpose: 4
• Operating Supply Voltage (typ): 2.5/3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 2.08V
• On-chip Adc: 8-chx10-bit
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 44
• Package Type: PQFP
• Lead Free Status / Rohs Status: Not Compliant

Chapter 3 Modes of Operation
3.1
The operating modes of the MC9S08GB/GT are described in this section. Entry into each mode, exit from
each mode, and functionality while in each of the modes are described.
3.2
3.3
This is the normal operating mode for the MC9S08GB/GT. This mode is selected when the BKGD/MS
pin is high at the rising edge of reset. In this mode, the CPU executes code from internal memory with
execution beginning at the address fetched from memory at $FFFE:$FFFF after reset.
3.4
The active background mode functions are managed through the background debug controller (BDC) in
the HCS08 core. The BDC, together with the on-chip debug module (DBG), provide the means for
analyzing MCU operation during software development.
Active background mode is entered in any of five ways:
After entering active background mode, the CPU is held in a suspended state waiting for serial background
commands rather than executing instructions from the user’s application program.
Freescale Semiconductor
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Active background mode for code development
Wait mode:
— CPU shuts down to conserve power
— System clocks running
— Full voltage regulation maintained
Stop modes:
— System clocks stopped; voltage regulator in standby
— Stop1 — Full power down of internal circuits for maximum power savings
— Stop2 — Partial power down of internal circuits, RAM contents retained
— Stop3 — All internal circuits powered for fast recovery
When the BKGD/MS pin is low at the rising edge of reset
When a BACKGROUND command is received through the BKGD pin
When a BGND instruction is executed
When encountering a BDC breakpoint
When encountering a DBG breakpoint
Introduction
Features
Run Mode
Active Background Mode
MC9S08GB/GT Data Sheet, Rev. 2.3
33