MC9S08GT16CFB Freescale Semiconductor, MC9S08GT16CFB Datasheet - Page 239

MC9S08GT16CFB

Manufacturer Part Number
MC9S08GT16CFB
Description
Manufacturer
Freescale Semiconductor
Datasheet

Specifications of MC9S08GT16CFB

Cpu Family
HCS08
Device Core Size
8b
Frequency (max)
20MHz
Interface Type
SCI/SPI
Program Memory Type
Flash
Program Memory Size
16KB
Total Internal Ram Size
1KB
# I/os (max)
36
Number Of Timers - General Purpose
4
Operating Supply Voltage (typ)
2.5/3.3V
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
2.08V
On-chip Adc
8-chx10-bit
Instruction Set Architecture
CISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
44
Package Type
PQFP
Lead Free Status / Rohs Status
Not Compliant

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Figure 15-2
The host is asynchronous to the target so there is a 0-to-1 cycle delay from the host-generated falling edge
to where the target perceives the beginning of the bit time. Ten target BDC clock cycles later, the target
senses the bit level on the BKGD pin. Typically, the host actively drives the pseudo-open-drain BKGD pin
during host-to-target transmissions to speed up rising edges. Because the target does not drive the BKGD
pin during the host-to-target transmission period, there is no need to treat the line as an open-drain signal
during this period.
Freescale Semiconductor
SYNCHRONIZATION
PERCEIVED START
(TARGET MCU)
BDC CLOCK
UNCERTAINTY
TRANSMIT 1
TRANSMIT 0
OF BIT TIME
HOST
HOST
shows an external host transmitting a logic 1 or 0 to the BKGD pin of a target HCS08 MCU.
Figure 15-2. BDC Host-to-Target Serial Bit Timing
MC9S08GB/GT Data Sheet, Rev. 2.3
TARGET SENSES BIT LEVEL
10 CYCLES
Background Debug Controller (BDC)
EARLIEST START
OF NEXT BIT
239

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