MC9S08GT16CFB Freescale Semiconductor, MC9S08GT16CFB Datasheet - Page 285

• Manufacturer Part Number: MC9S08GT16CFB
• Manufacturer: Freescale Semiconductor

Specifications of MC9S08GT16CFB

• Cpu Family: HCS08
• Device Core Size: 8b
• Frequency (max): 20MHz
• Interface Type: SCI/SPI
• Program Memory Type: Flash
• Program Memory Size: 16KB
• Total Internal Ram Size: 1KB
• # I/os (max): 36
• Number Of Timers - General Purpose: 4
• Operating Supply Voltage (typ): 2.5/3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 2.08V
• On-chip Adc: 8-chx10-bit
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 44
• Package Type: PQFP
• Lead Free Status / Rohs Status: Not Compliant

B.6
Freescale Semiconductor
SEATING
PLANE
-T-
42-Pin SDIP Package Drawing
42
1
D
F
0.25 (0.010)
42 PL
-A-
M
T
G
A
S
MC9S08GB/GT Data Sheet, Rev. 2.3
22
21
N
C
K
-B-
CASE 858-01
J
ISSUE O
42 PL
0.25 (0.010)
M
H
T
L
B
M
S
NOTES:
1.
2.
3.
4.
DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
CONTROLLING DIMENSION: INCH.
DIMENSION L TO CENTER OF LEAD WHEN FORMED
PARALLEL.
DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH.
MAXIMUM MOLD FLASH 0.25 (0.010).
DIM
G
M
A
B
C
D
F
H
J
K
L
N
1.435
0.540
0.155
0.014
0.032
0.008
0.115
0.020
MIN
0.070 BSC
0.300 BSC
0.600 BSC
0
42-Pin SDIP Package Drawing
INCHES
1.465
0.560
0.200
0.022
0.046
0.015
0.135
0.040
MAX
15
36.45
13.72
MILLIMETERS
MIN
3.94
0.36
0.81
0.20
2.92
0.51
DATE 02/27/90
1.778 BSC
15.24 BSC
7.62 BSC
0
37.21
14.22
MAX
5.08
0.56
1.17
0.38
3.43
1.02
15
285