MC9S08GT16CFB Freescale Semiconductor, MC9S08GT16CFB Datasheet - Page 273

• Manufacturer Part Number: MC9S08GT16CFB
• Manufacturer: Freescale Semiconductor

Specifications of MC9S08GT16CFB

• Cpu Family: HCS08
• Device Core Size: 8b
• Frequency (max): 20MHz
• Interface Type: SCI/SPI
• Program Memory Type: Flash
• Program Memory Size: 16KB
• Total Internal Ram Size: 1KB
• # I/os (max): 36
• Number Of Timers - General Purpose: 4
• Operating Supply Voltage (typ): 2.5/3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 2.08V
• On-chip Adc: 8-chx10-bit
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 44
• Package Type: PQFP
• Lead Free Status / Rohs Status: Not Compliant

A.9
This section describes ac timing characteristics for each peripheral system. For detailed information about
how clocks for the bus are generated, see
A.9.1
Freescale Semiconductor
Bus frequency (t
Real-time interrupt internal oscillator period
External reset pulse width
Reset low drive
Active background debug mode latch setup time
Active background debug mode latch hold time
IRQ pulse width
Port rise and fall time (load = 50 pF)
Slew rate control disabled
Slew rate control enabled
AC Characteristics
Control Timing
–60
2
3
cyc
= 1/f
Figure A-10. Internal Oscillator Deviation from Trimmed Frequency
Bus
–40
Parameter
1
)
–20
4
TEMPERATURE (°C)
–0.1
0.1
MC9S08GB/GT Data Sheet, Rev. 2.3
0
Table A-10. Control Timing
–0.2
–0.3
–0.4
–0.5
–0.6
Chapter 7, “Internal Clock Generator (ICG)
20
t
Symbol
Rise
t
t
t
MSSU
t
rstdrv
t
f
extrst
20
t
MSH
ILIH
Bus
RTI
, t
Fall
60
f
f
1.5 x t
Self_reset
Self_reset
1.5 x
34 x
Min
700
dc
25
25
—
—
cyc
80
Note: Device trimmed at 25°C at 2 V
Typical
2 V
3 V
30
—
3
100
Module.”
1300
Max
AC Characteristics
120
20
—
—
—
—
—
MHz
Unit
µs
ns
ns
ns
ns
ns
ns
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