EP2AGX190FF35C6N Altera, EP2AGX190FF35C6N Datasheet - Page 157

• Manufacturer Part Number: EP2AGX190FF35C6N
• Description: IC ARRIA II GX 190K 1152FBGA
• Manufacturer: Altera
• Series: Arria II GXr

Specifications of EP2AGX190FF35C6N

• Number Of Logic Elements/cells: 181165
• Number Of Labs/clbs: 7612
• Total Ram Bits: 9939
• Number Of I /o: 612
• Voltage - Supply: 0.87 V ~ 0.93 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C
• Package / Case: 1152-FBGA
• Family Name: Arria® II GX
• Number Of Logic Blocks/elements: 190300
• # I/os (max): 612
• Frequency (max): 400MHz
• Operating Supply Voltage (typ): 900mV
• Logic Cells: 190300
• Ram Bits: 10380902.4
• Operating Supply Voltage (min): 0.87V
• Operating Supply Voltage (max): 0.93V
• Operating Temp Range: 0C to 85C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 1152
• Package Type: FC-FBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Number Of Gates: -
• Lead Free Status / Rohs Status: Compliant

Chapter 6: I/O Features in Arria II GX Devices
Arria II GX Design Considerations
I/O Placement Guidelines
Pin Placement Guideline
© July 2010 Altera Corporation
Mixing Voltage-Referenced and Non-Voltage-Referenced Standards
An I/O bank can support both non-voltage-referenced and voltage-referenced pins by
applying each of the rule sets individually. For example, an I/O bank can support
SSTL-18 inputs and 1.8-V inputs and outputs with a 1.8-V V
Similarly, an I/O bank can support 1.5-V standards, 1.8-V inputs (but not outputs),
and HSTL and HSTL-15 I/O standards with a 1.5-V V
This section provides I/O placement guidelines for the programmable I/O standards
supported by Arria II GX devices and includes essential information for designing
systems with an Arria II GX device’s selectable I/O capabilities.
3.3-V, 3.0-V, and 2.5-V LVTTL/LVCMOS Tolerance Guidelines
Altera recommends the following techniques when you use 3.3-, 3.0-, and 2.5-V I/O
standards to limit overshoot and undershoot at I/O pins:
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■
■
■
Altera recommends creating a Quartus II design, enter your device I/O assignments,
and compile your design to validate your pin placement. The Quartus II software
checks your pin connections with respect to I/O assignment and placement rules to
ensure proper device operation. These rules are dependent on device density,
package, I/O assignments, voltage assignments, and other factors that are not
described in this chapter.
Low drive strength or series termination—The impedance of the I/O driver must
be equal to or greater than the board trace impedance to minimize overshoot and
undershoot at the un-terminated receiver end. If high driver strength (lower driver
impedance) is required, Altera recommends series termination at the driver end
(on-chip or off-chip).
Output slew rate—Arria II GX devices have two levels of slew rate control for
single-ended output buffers. Slow slew rate can significantly reduce the overshoot
and undershoot in the system at the cost of slightly slower performance.
Input clamping diodes—Arria II GX I/Os have on-chip clamping diodes.
When you use clamping diodes, the floating well of the I/O is clamped to V
a result, the Arria II GX device might draw extra input leakage current from the
external input driver. This may violate the hot-socket DC- and AC-current
specification and increase power consumption. With the clamping diode enabled,
the Arria II GX device supports a maximum DC current of 8 mA.
CCIO
and 0.75-V V
Arria II GX Device Handbook, Volume 1
CCIO
and a 0.9-V V
REF
.
REF
CCIO
.
. As
6–23