EP3C16Q240C8N Altera, EP3C16Q240C8N Datasheet - Page 122

IC CYCLONE III FPGA 16K 240PQFP

EP3C16Q240C8N

Manufacturer Part Number
EP3C16Q240C8N
Description
IC CYCLONE III FPGA 16K 240PQFP
Manufacturer
Altera
Series
Cyclone® IIIr

Specifications of EP3C16Q240C8N

Number Of Logic Elements/cells
15408
Number Of Labs/clbs
963
Total Ram Bits
516096
Number Of I /o
160
Voltage - Supply
1.15 V ~ 1.25 V
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 85°C
Package / Case
240-MQFP, 240-PQFP
Family Name
Cyclone III
Number Of Logic Blocks/elements
15408
# I/os (max)
92
Frequency (max)
402MHz
Process Technology
65nm
Operating Supply Voltage (typ)
1.2V
Logic Cells
15408
Ram Bits
516096
Operating Supply Voltage (min)
1.15V
Operating Supply Voltage (max)
1.25V
Operating Temp Range
0C to 85C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
240
Package Type
PQFP
For Use With
544-2601 - KIT DEV CYCLONE III LS EP3CLS200P0037 - BOARD DEV/EDUCATION ALTERA DE0544-2411 - KIT DEV NIOS II CYCLONE III ED.
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Number Of Gates
-
Lead Free Status / Rohs Status
Compliant
Other names
544-2458

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0
6–22
Table 6–7. Chapter Revision History (Part 2 of 3)
Cyclone III Device Handbook, Volume 1
May 2008
Date
Version
2.0
Changes include addition of BLVDS information.
Added an introduction to “I/O Element Features” section.
Updated “Slew Rate Control” section.
Updated “Programmable Delay” section.
Updated Table 6–1 with BLVDS information.
Updated Table 6–2.
Updated “PCI-Clamp Diode” section.
Updated “LVDS Transmitter Programmable Pre-Emphasis” section.
Updated “On-Chip Termination with Calibration” section and added new
Figure 6–9.
Updated Table 6–3 title.
Updated Table 6–4 unit.
Updated “I/O Standards” section and Table 6–5 with BLVDS information and
added (Note 5).
Updated “Differential I/O Standard Termination” section with BLVDS
information.
Updated “I/O Banks” section.
Updated (Note 2) and added (Note 7) and BLVDS information to
Figure 6–15.
Updated (Note 2) and added BLVDS information to Table 6–6.
Added MBGA package information to Table 6–7.
Deleted Table 6-8.
Updated “High-Speed Differential Interfaces” section with BLVDS
information.
Updated “Differential Pad Placement Guidelines” section and added new
Figure 6–16.
Updated “V
Figure 6–17.
Updated Table 6–11.
Added new “DCLK Pad Placement Guidelines” section.
Updated “DC Guidelines” section.
REF
Pad Placement Guidelines” section and added new
Chapter 6: I/O Features in the Cyclone III Device Family
Changes Made
© December 2009 Altera Corporation
Chapter Revision History

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