SAA7105E/V1/G NXP Semiconductors, SAA7105E/V1/G Datasheet - Page 76

• Manufacturer Part Number: SAA7105E/V1/G
• Description: Video ICs PC-DENC
• Manufacturer: NXP Semiconductors

Specifications of SAA7105E/V1/G

• Adc/dac Resolution: 10b
• Screening Level: Commercial
• Package Type: LBGA
• Pin Count: 156
• Lead Free Status / RoHS Status: Compliant
• Other names: SAA7105E/V1/G,557

Philips Semiconductors
16. Revision history
Table 116: Revision history
SAA7104E_SAA7105E_2
Product data sheet
Document ID
SAA7104E_SAA7105E_2 20051223
Modifications:
SAA7104E_SAA7105E_1 20040304
[4]
[5]
[6]
[7]
[8]
[9]
Release date Data sheet status Change notice Doc. number Supersedes
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
Hot bar soldering or manual soldering is suitable for PMFP packages.
•
•
•
The format of this data sheet has been redesigned to comply with the new presentation and
information standard of Philips Semiconductors
Table
Package outline changed from SOT472-1 to SOT700-1
4: updated description for pin E2
Product data sheet CPCN
Product
specification
Rev. 02 — 23 December 2005
200505019
-
SAA7104E; SAA7105E
-
9397 750
11436
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
SAA7104E_SAA7105E_1
-
Digital video encoder
76 of 78