QT2032-EKG-1A2 Applied Micro Circuits Corporation, QT2032-EKG-1A2 Datasheet - Page 218

• Manufacturer Part Number: QT2032-EKG-1A2
• Manufacturer: Applied Micro Circuits Corporation

Specifications of QT2032-EKG-1A2

• Lead Free Status / RoHS Status: Supplier Unconfirmed

QT2022/32 - Data Sheet: DS3051
Table 78: Revision History
218
5.11
5.10
5.00
2.03
2.02
2.01
2.00
1.02
1.01
Rev
April 7, 2010
March 11, 2010
December 16, 2009
November 4, 2009
September 4, 2009
March 4, 2008
December 20, 2006
October 13, 2006
September 19, 2006
Date
Updated the “Revision History” notes for Revision 5.00 with additional details about the solder ball diam-
eter (see underlined text).
Updated “WIS Synchronization (Octet and Frame Delineation)” on page 41 with more information on
framing pattern.
Added Section “SEF Defect Generation” on page 41, Section “LOF Defect Generation” on page 42 and
“LOS Defect Generation” on page 42.
Corrected typo on Section 8.4.1 on page 62 to reference register field 1.9002h.7 instead of 1.9002h.3.
Updated marking drawing in Figure 55 on page 207 to include the AppliedMicro lot code (add Row #4)
Indicated tolerances for parameters D and E of Package Outline Drawing in Figure 52 on page 203.
Corrected turnaround (TA) timing in MDIO Read and Read Increment transactions in figure 23 on
page 76.
Page 201, Package Outline Drawing updated. The nominal solder ball diameter (b) was changed from
0.46mm to 0.45mm, in accordance with JEDEC Standard Procedures and Practices. See JEDEC Publi-
cation No. 95, SPP-003 Issue C, Item Number 11.2-740(S) for details.
Page 201, reference to ball diameter removed.
Page 216, ordering information changed from QT2022PRKCB-1 to QT2022PRKCB
Page 206, added Marking Drawing
Page 217, updated Ordering Information
Pg 13, Corrected description of EREFCLKC input. Added requirement for external AC coupling.
Increased maximum power consumption specification for WAN mode in Table 55 on page 187.
Changed DJ specification for 10Gbps serial transmitter in Table 71 on page 198.
Changed maximum current draw for XV1P2 and TV1P2 power supplies in Table 55 on page 187.
Decreased maximum current draw for RV1P2 power supply in Table 55 on page 187.
Added specification of maximum current draw for COREVCC power supply in Table 55 on page 187.
Inserted additional Iol specification for MDIO in Table 60 on page 189 to show IEEE compliance.
Changed pullup specification for 3.3V operation for MDIO in Table 60 on page 189.
Corrected definition of 2.C500h bit 8 to be Reserved (RO); corrected definition of 2.C500h bit 9 to be
“Far-end AIS-P/LOP-P” (RO)
Corrected definition of 1.C003h bits 15:14 to remove 600kHz operation which is not supported by I2C.
Corrected definition of “PHY_XS Code Error” to properly refer to the XAUI code violation fields in
4.C006h.3:0 in Table 25 on page 65.
Updated bit field definition of 1.8.10 (PMA Receive Local Fault) and 1.8.11 (PMA Transmit Local Fault) to
be consistent with Table 19 on page 58. Also updated text description of Section 8.2.4 on page 55 for
consistency.
Updated the definition of 2.C502h bits 7 and 6 to more accurately describe the behavior in Table 29 on
page 68 and in the register map (2.C502h and 2.C501h updated).
Corrected definition of “Receive Optical Power Fault” on page 126 to “RO”. Now consistent with definition
in Table 24 on page 64.
Corrected definition of MDIO register 2.C002h.9 to “WIS TX SS Bit Insert Enable” on page 151.
Added text describing features and usage of WIS Tx OH Byte Insert feature in Section 7.3.9 on page 49.
Updated definition of WIS register field 2.C000h.5 to match behavior as flag that detects NDF.
Note: In this document, deleted text is shown with a strikethrough. Inserted text is underlined.
Minor updates
Converted to AMCC format.
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Description
Revision 5.11