QT2032-EKG-1A2 Applied Micro Circuits Corporation, QT2032-EKG-1A2 Datasheet - Page 208

• Manufacturer Part Number: QT2032-EKG-1A2
• Manufacturer: Applied Micro Circuits Corporation

Specifications of QT2032-EKG-1A2

• Lead Free Status / RoHS Status: Supplier Unconfirmed

QT2022/32 - Data Sheet: DS3051
17 Thermal
The QT2022/32 190-ball LBGA package incorporates state-of-the-art high speed performance in a low-cost plastic
package with an advanced thermal solution. There are two primary thermal paths, junction-to-case (JC) and junc-
tion-to-ball (JB).
The central 5x5 ball array on the package provide 25 thermal relief paths into the PCB substrate. These are used
as a primary heat dissipation path for the chip. To optimize thermal performance, please ensure there is a ground
via for each thermal ball in the layout. Thermal modelling is based on a 1S2P multilayer JEDEC standard
(100x100 mm), 1.6 mm FR4 PCB.
The thermal model for the package is given in Figure 56. Package thermal parameters are given in Table 56, “190B
LBGA Package Constants,” on page 188.
Figure 56: LBGA Thermal Model
208
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PACKAGE
PCB
DIE
T
C
T
T
J
A
θ
θ
CA
JC
θ
JB
θ
BA
Revision 5.11