QT2032-EKG-1A2 Applied Micro Circuits Corporation, QT2032-EKG-1A2 Datasheet - Page 188

• Manufacturer Part Number: QT2032-EKG-1A2
• Manufacturer: Applied Micro Circuits Corporation

Specifications of QT2032-EKG-1A2

• Lead Free Status / RoHS Status: Supplier Unconfirmed

QT2022/32 - Data Sheet: DS3051
Table 56: 190B LBGA Package Constants
Note that
a 1S2P multi-layer JEDEC standard PCB (FR-4, 4” x 4”, 0.063” thick) under forced convection with 0.5m/s
(100LFM) airflow.
Table 57: General CMOS I/O DC Parameters
Table 58: LED1, LED2, LED3 Output DC Parameters
188
Parameter
Vol
Ioff
Iol
Vih
Vil
Rpd
Rpu
Hyst
Cio
Vol
Parameter
Parameter
θ
θ
θ
JC
JB
JA
θ
JB
Junction-to-Case Thermal Resistance
Junction-to-Ball Thermal Resistance
Junction-to-Ambient Thermal Resistance
was calculated using boundary conditions defined in JESD51-8. Note that
output low voltage level
output low voltage
Open-drain output off-state leakage
output low current
input high voltage level
input low voltage level
input pad pulldown resistance
See Table 3 on page 13 for a list of pads
with pulldowns
input pad pullup resistance
See Table 3 on page 13 for a list of pads
with pullups
hysteresis
input / output capacitance
Description
Description
Description
AppliedMicro - Confidential & Proprietary
Min
8
0.84
30
21
14
30
Min
Min
Typ
12.3
22.7
32.7
29.5
28.2
50
36
24
50
80
35
3.5
Typ
Typ
Max
0.4
Max
0.2
2.5
0.36
95
49
46
95
5
Units
o
o
o
Max
C/W
C/W
C/W
V
Units
Calculated using boundary conditions
defined in JESD51-8.
air flow
1 m/s air flow, no heat sink.
2 m/s air flow, no heat sink.
V
μ A
mA
V
V
k Ω
k Ω
mV
pF
With natural convection only, no heat sink or
Units
sinking 10mA
Iol = 4mA
at 2.5V
Vol = 0.6V
3.3V tolerant
TDI,TMS
TRST_N, RESETN
all other pads with pullups
Applies to RESETN, TRST_N,
EEPROM_SCL and
EEPROM_SDA pins
Applies to MDC, TMS, TDCC,
TCK and TDI pins
Vio(dc) = 0.6V
Conditions/Notes
θ
Conditions/Notes
JA
was calculated using
Conditions
Revision 5.11